Instant adhesion is possible with ultraviolet light exposure! It is used in a wide range of fields where adhesive reliability is required.
The "AroNix BU Series" is a one-component, solvent-free type of ultraviolet-curing anaerobic adhesive. It allows for instant bonding through UV irradiation, significantly reducing work time. The grades with anaerobic curing properties also cure in areas not exposed to UV light. With excellent tensile strength, peel strength, and impact strength, and high durability, it is used in a wide range of fields where adhesive reliability is required, including low voltage, electronics, and automotive applications. 【Features】 - Instant bonding through UV irradiation significantly reduces work time. - Grades with anaerobic curing properties also cure in areas not exposed to UV light. - The use of primers and heat expands the range of adhesive applications. - Being one-component, it does not require weighing or mixing, making it convenient to handle. - Since oligomers are the main component, there is almost no shrinkage. *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Lineup】 ■BU-810 ■BU-510U ■BU-730UF *For more details, please refer to the PDF document or feel free to contact us.
Price information
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Delivery Time
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Applications/Examples of results
【Application Areas】 ■ Adhesion of motor shafts and magnets ■ Adhesion of piezoelectric elements ■ Adhesion of printed circuit boards and coils *For more details, please refer to the PDF document or feel free to contact us.
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Ultraviolet and anaerobic curing type adhesive "Alonix BU Series"
Company information
Toho Chemical Industry offers a range of distinctive adhesives developed through Aronalfa and proprietary technologies. To meet diverse needs, from household use to industrial applications such as electronic materials, automobiles, and precision equipment, we have enhanced our lineup of high-performance adhesives, contributing to faster manufacturing and repair processes as well as cost reduction through the bonding of various materials.
