[Example] Thermal conduction analysis using thermal coupling functionality

We analyzed the temperature distribution of heat conduction due to heat generation from the chip in a structure composed of a chip, substrate, edge guide, and case.

【Case Overview】 ■Product Name: Femap Thermal ■Analysis: Thermal Analysis ■Industry: Mechanical Components Modeling thermal connections between components can be challenging due to thermal resistance from contact and heat conduction at adhesive joints. By using the thermal coupling feature, it is possible to define conductive conductance, thermal conductivity, or thermal resistance values between distant meshes that do not share nodes, allowing for thermal coupling in calculations between these distant meshes. This is an excellent feature that automatically considers the positional relationships of elements and allocates the degree of thermal coupling for each element. In this analysis case, we will analyze the temperature distribution due to heat generation from a chip within a structure consisting of four types of components: chip, substrate, edge guide, and case. The adhesive between the chip and substrate, as well as the edge guide that connects the substrate and case, were modeled using thermal coupling. □ For other functions and details, please refer to the catalog.

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