Moisture-curing adhesive
This is a moisture-curing adhesive that combines the fast bonding properties of hot melt adhesives with the heat resistance and durability of reactive adhesives. It is suitable for bookbinding applications as an adhesive with paper recycling properties and resistance to ink solvents.
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basic information
【Features】 ○ Speeding up adhesive work (high-speed adhesion) ○ Solvent-free ○ Cures with moisture in the environment ○ Heat resistance, solvent resistance ○ Thermal reactivation adhesion is also possible (before reaction) ● For more details, please contact us or refer to the catalog.
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Delivery Time
※Please feel free to contact us.
Applications/Examples of results
Building materials, woodworking (wrapping, panels) Automotive, vehicle use (seat covers) For bookbinding For laminating ● For more details, please contact us.
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Company information
Ishizuka Sangyo Co., Ltd. is a company located in Takinogawa, Kita-ku, Tokyo, that deals with industrial adhesives and binding and printing-related machinery.
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