Implementation using anisotropic conductive film (ACF)
Implementation using anisotropic conductive film (ACF) 【Features】 ○ A film formed by mixing conductive fine metal particles with a thermosetting resin and shaping it into a membrane ○ Conductivity is maintained in the vertical direction, while insulation is maintained in the horizontal direction, creating anisotropy ○ When sandwiched between electrodes and subjected to heat and pressure, pressure is applied only to the film area where the electrodes contact, causing the particles dispersed within the film to be pressed together, allowing the plating layers of the ACF particles to bond together and conduct electricity ● For more details, please contact us or download the catalog.
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basic information
Implementation using anisotropic conductive film (ACF) 【Features】 ○ A film formed by mixing conductive fine metal particles with a thermosetting resin and molding it into a film shape ○ Conductivity is maintained in the vertical direction, while insulation is maintained in the horizontal direction, creating anisotropy ○ When sandwiched between electrodes and subjected to heat and pressure, pressure is applied only to the film area where the electrodes contact, causing the particles dispersed within the film to be pressed together, allowing the plating layers of the particles in the ACF to bond together and conduct electricity ● For more details, please contact us or download the catalog.
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Applications/Examples of results
●COF (Mounting IC chips on flexible substrates) ●FOG (Mounting flexible substrates on glass substrates) ●COG (Mounting IC chips on glass substrates) ●FOB (Mounting flexible substrates on rigid substrates) ●FOF (Mounting flexible substrates to each other) ●FOP (Mounting flexible substrates on film substrates (PET))
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Company information
We undertake various implementations related to flat panel displays (LCD, organic EL, etc.) such as COF, flip chip, COG, TAB, and heat seal. In particular, we also handle extremely small lot implementations during the research and development and prototyping stages, which can be helpful for our customers facing challenges in their R&D phases. We accept custom design and manufacturing of TN and STN specification LCD modules for industrial applications such as measuring instruments and medical devices, starting from small lots (1K) to custom-made solutions. Our production equipment primarily includes ACF bonding machines, and we offer semi-automatic machines. There are advantages to using them offline for research and development, prototyping, and repair purposes.
