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  1. Home
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  3. ネットロックシステム 物流IT事業部
  4. Notice of Participation in the International Logistics Comprehensive Exhibition 2022 Logis-Tech Tokyo 2022 (September 13-16, 2022, Big Sight)
SEMINAR_EVENT
  • Aug 15, 2022
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Aug 15, 2022

Notice of Participation in the International Logistics Comprehensive Exhibition 2022 Logis-Tech Tokyo 2022 (September 13-16, 2022, Big Sight)

ネットロックシステム ネットロックシステム 物流IT事業部
We are pleased to announce that our company will be exhibiting at the "International Logistics Comprehensive Exhibition 2022 Logis-Tech Tokyo 2022." At our exhibition booth, we will demonstrate the loading automatic calculation system "Vanning Master," and we will discuss its use with customers while showcasing its operation. Additionally, we will also be available for consultations regarding our consulting services for your logistics challenges. We believe both will be helpful in solving your logistics issues. ● Exhibition Booth Date: September 13 (Tuesday) to 16 (Friday), 10:00 AM to 5:00 PM Location: Tokyo Big Sight, Tokyo International Exhibition Center, Hall 7 [7-306] * A corner for experiencing the loading automatic calculation system (Vanning Master) will be prepared. ● Seminar Date: September 15 (Thursday), 1:40 PM to 2:10 PM (Capacity: 100 people) Location: Seminar Room C, Halls 7 and 8 Content: Recommended for those in the e-commerce industry! Cost reduction through automatic optimal selection of packaging materials. We sincerely look forward to your visit.
Booth image
Booth image
Date and time Tuesday, Sep 13, 2022 ~ Friday, Sep 16, 2022
10:00 AM ~ 05:30 PM
Tokyo Big Sight Tokyo International Exhibition Center Hall 7 [7-306]
Capital 3-11-1 Ariake, Koto City, Tokyo 135-0063 Tokyo Big Sight, Tokyo International Exhibition Center, Hall 7 [7-306]
Entry fee Free
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Loading Calculation System "Vanning Master"

Automatically create loading plans that minimize dead space. Presentation of materials introducing features and improvement examples. Trial version available.

"Banning Master" is a system that visualizes cargo based on size information and creates loading plans considering weight balance, constraints, and workability. It optimizes loading efficiency for containers, trucks, pallets, etc., and can flexibly respond to additions or cancellations of cargo. It can also be used to identify bottlenecks and continuously improve loading efficiency. We offer a "software version" that can be tailored to your business needs and a "cloud version" that requires no installation. 【Features】 ■ Automatically calculates and visualizes highly efficient loading plans ■ Properly calculates the center of gravity, preventing cargo shifts and contributing to improved transport quality ■ Many successful implementations in automotive parts, electronics, food, and building materials manufacturers ■ Capable of providing algorithms that consider loading rules ★ We are currently offering materials that include examples of improvements in import and export of goods. You can view them immediately via "PDF Download." * A trial version of the cloud version (10 days) is also available. Please contact us for more details.

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最適箱選択2.jpg

Optimization software for cardboard box sizes: "Optimal Box Proposal Engine"

Calculate the size of cardboard boxes that perfectly fit the product to reduce shipping costs. An example of a reduction of 2.5 million yen per month.

The "Optimal Box Proposal Engine" is software that analyzes the size information of shipped products and cardboard boxes to calculate the minimum size of cardboard boxes that fit the product size. By minimizing the total length of the three dimensions (length, width, height) that affect shipping costs, it enables the reduction of shipping and material costs. Regular analysis also helps prepare appropriate cardboard boxes in line with the transition to new products. 【Features】 ■ Calculates the reduction rate of shipping costs compared to using the original box ■ There are cases where shipping costs were reduced by approximately 2.5 million yen Since actual data on shipped products is required, this is proposed in conjunction with the packaging box selection engine (BOX Engine). * Packaging box selection engine: https://www.vanning-master.jp/vm_cb01.html * For more details, please refer to the PDF materials. Feel free to contact us with any inquiries.

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Related catalog(2)

Packing Optimization for Cardboard Boxes 'Vanning Master PLUS'

Packing Optimization for Cardboard Boxes 'Vanning Master PLUS'

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Automatic Calculation Web Service for Accumulated Payments 'VM-Cloud' (10-day free trial available)

Automatic Calculation Web Service for Accumulated Payments 'VM-Cloud' (10-day free trial available)

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Building materials, supplies and fixtures manufacturers
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Automobile and Technology Exhibition 2026 YOKOHAMA

Notice of Participation in the 2026 Yokohama Automotive Technology Exhibition

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  • SEMINAR_EVENT

Sekisui Filler Co., Ltd. will be exhibiting at the "Automotive Technology Exhibition 2026 YOKOHAMA" held at PACIFICO YOKOHAMA from May 27. (Booth number 285, within the Sekisui Chemical booth) 【Exhibited Products】 Mobility G - Re-sealable gasket HM (EV Seal 500) - Interior materials (Thermonex/Swiftlock) - Battery protection materials (EV Protect 4006SFR, etc.) Electronics / Car Electronics - Adhesives for camera modules - Adhesives for displays - Conformal coating agents - Optical adhesives We sincerely look forward to your visit.

May 15, 2026

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[Free WEB Seminar] Unraveling the Challenges of GaN/SiC Devices Not Visible in DC Measurements: Latest Evaluation Method of Pulse IV × Thermal Reflection Imaging

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  • SEMINAR_EVENT

In the evaluation of GaN HEMTs, DC measurements alone cannot capture the true behavior of the device in actual operation. Phenomena such as current collapse caused by self-heating and trap effects can lead to RF output degradation and reliability deterioration. In this free online seminar, top researchers from the United States will present the latest evaluation workflow that integrates pulse IV measurements, RF characteristic evaluation, and thermal reflection imaging. The seminar will be conducted in English without interpretation, so please join us. 【Main Program】 Analysis of correlation data for pulse IV/RF/thermal reflection imaging of GaN devices Thermal degradation mechanisms of GaN, SiC, etc., and their impact on reliability Exceeding the limits of IR (infrared) with picosecond resolution thermal reflection imaging Automated wafer-level evaluation system for RF/silicon photonics 【Event Overview】 Date: May 27, 2026, 7:00 AM or 7:00 PM (PDT) *Japan Time: May 27 (Wed) 11:00 PM or May 28 (Thu) 7:00 AM Participation Fee: Free (online broadcast with live Q&A) This seminar is packed with tips for next-generation device development. Please register!

May 14, 2026

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For HR & Back Office Professionals —n an era where rising costs are impacting hiring and retention—

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  • SEMINAR_EVENT

Are you facing challenges where salary increases don’t necessarily lead to higher take-home pay? In this seminar, together with a certified social insurance and labor consultant, we will explore future HR strategies from both perspectives: system design and practical implementation. ✔ HR strategies under inflationary pressure ✔ Rethinking compensation and benefits design ✔ Real case studies for improving hiring & retention ✔ The concept of the “third wage increase” and how to apply it ―――――――――― ■ Event Details Date: May 27, 2026 (Wed) 18:30–20:00 Location: Kort Valuta Inc. (Shibuya, Tokyo) Fee: Free ―――――――――― ▼ Register here https://forms.gle/SByk7qn7VZRPuEZs8 ▼ Learn more (Press Release) https://prtimes.jp/main/html/rd/p/000000107.000076589.html #HR #HumanResources #EmployeeEngagement #Compensation #Benefits #Fintech

May 14, 2026

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Paid Course: "Beginner's Edition! For Those Using 'Reinforced Soil' for the First Time - 'Excavation Reinforced Soil Construction Method Implementation Workshop'"

[June 12, 2026 - CPDS Certified] Paid Course: "Beginner's Edition! For Those Using 'Reinforced Soil' for the First Time - 'Excavation Reinforced Soil Construction Method Implementation Workshop'"

  • NEW
  • SEMINAR_EVENT

**Lecture Content and Instructor** 13:30 - 14:20 Overview of Cut Slope Reinforcement Soil Method Design (50 minutes) 14:20 - 14:30 [Break] (10 minutes) 14:30 - 15:20 Implementation of Cut Slope Reinforcement Soil Method Calculation System 'Reinforced Soil' [First Half] (50 minutes) 15:20 - 15:30 [Break] (10 minutes) 15:30 - 16:30 Implementation of Cut Slope Reinforcement Soil Method Calculation System 'Reinforced Soil' [Second Half] (60 minutes) Godai Development Co., Ltd. System Technology Department, Development Section Masatoshi Miura For more details, please check the link below.

May 14, 2026

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Fukuoka Premium Incentive Show 2026

Announcement of Participation in the Fukuoka Premium Incentive Show 2026

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  • SEMINAR_EVENT

Daitō Shikō Co., Ltd. will exhibit at the "Fukuoka Premium Incentive Show 2026," which will be held at Marine Messe Fukuoka Hall B from Thursday, June 11, 2026. At the exhibition venue, we plan to showcase a variety of popular items, including clear trading cards and classic novelties. If you are looking for SP tools, promotional items, or novelties, please be sure to visit our booth.

May 14, 2026

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