[Free WEB Seminar] Unraveling the Challenges of GaN/SiC Devices Not Visible in DC Measurements: Latest Evaluation Method of Pulse IV × Thermal Reflection Imaging

Sekisui Filler Co., Ltd. will be exhibiting at the "Automotive Technology Exhibition 2026 YOKOHAMA" held at PACIFICO YOKOHAMA from May 27. (Booth number 285, within the Sekisui Chemical booth) 【Exhibited Products】 Mobility G - Re-sealable gasket HM (EV Seal 500) - Interior materials (Thermonex/Swiftlock) - Battery protection materials (EV Protect 4006SFR, etc.) Electronics / Car Electronics - Adhesives for camera modules - Adhesives for displays - Conformal coating agents - Optical adhesives We sincerely look forward to your visit.

In the evaluation of GaN HEMTs, DC measurements alone cannot capture the true behavior of the device in actual operation. Phenomena such as current collapse caused by self-heating and trap effects can lead to RF output degradation and reliability deterioration. In this free online seminar, top researchers from the United States will present the latest evaluation workflow that integrates pulse IV measurements, RF characteristic evaluation, and thermal reflection imaging. The seminar will be conducted in English without interpretation, so please join us. 【Main Program】 Analysis of correlation data for pulse IV/RF/thermal reflection imaging of GaN devices Thermal degradation mechanisms of GaN, SiC, etc., and their impact on reliability Exceeding the limits of IR (infrared) with picosecond resolution thermal reflection imaging Automated wafer-level evaluation system for RF/silicon photonics 【Event Overview】 Date: May 27, 2026, 7:00 AM or 7:00 PM (PDT) *Japan Time: May 27 (Wed) 11:00 PM or May 28 (Thu) 7:00 AM Participation Fee: Free (online broadcast with live Q&A) This seminar is packed with tips for next-generation device development. Please register!

Are you facing challenges where salary increases don’t necessarily lead to higher take-home pay? In this seminar, together with a certified social insurance and labor consultant, we will explore future HR strategies from both perspectives: system design and practical implementation. ✔ HR strategies under inflationary pressure ✔ Rethinking compensation and benefits design ✔ Real case studies for improving hiring & retention ✔ The concept of the “third wage increase” and how to apply it ―――――――――― ■ Event Details Date: May 27, 2026 (Wed) 18:30–20:00 Location: Kort Valuta Inc. (Shibuya, Tokyo) Fee: Free ―――――――――― ▼ Register here https://forms.gle/SByk7qn7VZRPuEZs8 ▼ Learn more (Press Release) https://prtimes.jp/main/html/rd/p/000000107.000076589.html #HR #HumanResources #EmployeeEngagement #Compensation #Benefits #Fintech

**Lecture Content and Instructor** 13:30 - 14:20 Overview of Cut Slope Reinforcement Soil Method Design (50 minutes) 14:20 - 14:30 [Break] (10 minutes) 14:30 - 15:20 Implementation of Cut Slope Reinforcement Soil Method Calculation System 'Reinforced Soil' [First Half] (50 minutes) 15:20 - 15:30 [Break] (10 minutes) 15:30 - 16:30 Implementation of Cut Slope Reinforcement Soil Method Calculation System 'Reinforced Soil' [Second Half] (60 minutes) Godai Development Co., Ltd. System Technology Department, Development Section Masatoshi Miura For more details, please check the link below.

Daitō Shikō Co., Ltd. will exhibit at the "Fukuoka Premium Incentive Show 2026," which will be held at Marine Messe Fukuoka Hall B from Thursday, June 11, 2026. At the exhibition venue, we plan to showcase a variety of popular items, including clear trading cards and classic novelties. If you are looking for SP tools, promotional items, or novelties, please be sure to visit our booth.