Bostik announces the latest engineering adhesive in Asia, UV-curable gasket AU588.

Bostik, a specialized adhesive company expanding into the global market (www.bostik.com), announces its latest innovations in engineering adhesives. This is part of the company's goal to create smart solutions for Industry 4.0 in Asia.
In response to the demands of modern industry, the newly developed AU588 gasket solution replaces traditional gaskets and supports the automation of manufacturing processes. This is the latest product in Bostik's renowned Bostik Born2Bond portfolio, known for its high-durability UV-curable Cure-In-Place Gasket (CIPG) products.
Bostik features value propositions that align with industry trends, including high efficiency, automated processes, complex designs, miniaturization, lightweighting, waste reduction, and waterproofing/dustproofing.
The AU588 can be applied to industrial electronics and factory automation-related components, such as advanced driver-assistance systems (ADAS) and electronic control units (ECU).
For more details, please visit the product page.

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