I am participating in Interop Tokyo 2020 online.

Data center thermal management simulation software available for operational managers to use in daily tasks with DCIM integration.

TileFlow is a thermal airflow analysis software specifically designed for data centers. It accurately responds to the increasing demands for energy efficiency year after year with advanced algorithms developed by S.V. Patankar. On-site personnel can handle equipment additions and layout changes themselves. Results can be visualized quickly and easily. For data center operations managers, it has a proven track record as a highly efficient software, particularly in the United States and among major data centers. We would be happy to provide a demo explanation upon request. It is also possible to conduct this via a web conference. We can also offer experiential training if requested through our company website. InteRop Tokyo 2017 Special Award in the Management & Monitoring category

• Unit and other construction
• Scientific Calculation and Simulation Software
• Sales promotion and sales support software

User-friendly multi-purpose 27U scalable blanking panel for 19-inch racks and versatile multi-purpose baffle system (shielding panel) flame retardant.

High flame-retardant sheet Flame-retardant standard UL94 V-0, compliant with RoHS directive. The material is a non-conductive, inert polypropylene compound. The official name of the 19-inch blank panel is PlenaFill. The shielding panel used for underfloor applications is PlenaForm. The vertical space shielding panel for wide racks is PlenaVertical. Each is sold in box units made of the same material. Pricing and other details will be provided by the distributor. Reference standard prices (revised January 2024, prices effective after February 1): The standard price for PlenaFill is 1 box of 270U (installation rivets not included) for ¥197,800. The price for PlenaForm is open. The price for PlenaVertical is 1 box of 540U (installation rivets not included) for ¥160,000. The price for S99PlenaVertical is 1 box of 540U (installation rivets not included) for ¥100,000. These products are being utilized by major data centers, including those in the United States. They are recommended for purchase and effectiveness by the U.S. Department of Energy. For detailed explanations and sample requests, please feel free to contact us.

• Safety and consumables

A solution that achieves optimal air conditioning environments and energy savings through automatic measurement and control using learning functions.

By linking the indoor wireless temperature sensor module with the air conditioning unit, the target air conditioning unit is selected and automatically controlled according to the fluctuations in the measurement values of each sensor. This optimal control achieves a reduction in air conditioning power consumption of up to 30%.

• Air conditioning equipment
• Automatic Control Equipment
• Heating and cooling equipment and facilities

Achievement No. 1: Thermal Analysis Simulation System for Data Centers - A simulation system for energy-saving predictions that can be directly used by DC operations managers.

TileFlow is a thermal airflow analysis software specifically designed for data centers. It accurately responds to the increasing demands for energy efficiency year after year with the advanced algorithm (Exponential Method) developed by S.V. Patankar. On-site personnel can handle equipment additions and layout changes themselves. Results can be visualized quickly and easily. It is a user-friendly software for operations managers and is the number one software with a proven track record among major data centers, particularly in the United States. It can integrate with various DCIM software to visualize the current situation and conduct future considerations. Awarded the Special Prize in the Management & Monitoring category at InteRop Tokyo 2017 and was a finalist in the Demonstration category at InteRop Tokyo 2016.

• Unit and other construction

The housing industry is currently facing a significant turning point due to factors such as population decline, a reduction in demand for new construction, and intensified price competition. This seminar will clearly explain the "business model transformation strategies" necessary for construction companies to survive and continue to grow in such a challenging environment. We will introduce specific approaches that can be immediately applied on-site, along with a roadmap to success.

Nitto Kohki will hold the "2025 Attack Fair in Meiko" for two days from July 23 (Wednesday) to July 24 (Thursday), 2025, at the "Kowa Seminar Plaza 2F Training Room No. 12 (inside Kowa Sports Land)." The Attack Fair is an exhibition where you can actually "see, touch, and operate" Nitto Kohki's products. Additionally, there will be wonderful souvenirs for attendees and many fun activities prepared. We look forward to welcoming everyone!

ODS Corporation, a manufacturer of business information terminals (headquartered in Chiyoda-ku, Tokyo, President: Kiyoshi Sunanaga), in collaboration with Magconn Corporation (headquartered in Kokubunji City, Tokyo, President: Satoshi Inoue), will showcase its business tablets at the "HCJ2026 International Hotel and Restaurant Show" to be held at Tokyo Big Sight from February 17 (Tuesday) to 20 (Friday), 2026. We will present the Android model "TA2C-NF8" equipped with an NFC reader/writer, which can be utilized in restaurants and hotels, as well as the Windows model "TW2A-NF9LTA" with an NFC reader/writer, which will be unveiled for the first time at this exhibition and is scheduled for release in March. By combining these products with Magconn's charging system, which allows for stable charging with a one-touch magnetic attachment, we aim to propose improvements in operational efficiency and the creation of new business opportunities utilizing NFC solutions.

The Practical Solution Fair is one of Japan's largest IT comprehensive exhibitions, hosted by Otsuka Shokai, held once a year. This year's theme is "Expanding with AI! Complete DX." The venue will showcase the latest business efficiency tools utilizing AI, and Paperlogic will exhibit "Electronic Contracts" and "Construction Document DX Pocket." ■ Date February 18, 2026 (Wednesday) 10:00 AM - 5:00 PM (last entry) February 19, 2026 (Thursday) 9:30 AM - 5:00 PM (last entry) Applications for attendance are accepted until 5 PM on each day. ■ Venue Grand Cube Osaka (Osaka Prefectural International Conference Hall): 5-3-51 Nakanoshima, Kita Ward, Osaka City, Osaka Prefecture ■ Participation method: Free, registration required https://it-event.otsuka-shokai.co.jp/osaka/ ▼ For details on the Tokyo venue, click here https://note.com/paperlogic/n/nb096d59149dc

We will be exhibiting at "JAPAN SHOP 2026," which will be held at Tokyo Big Sight from March 3 (Tuesday) to March 6 (Friday), 2026.