Announcement of Exhibition and Presentation of 'Made in Niigata New Technology (Civil Engineering and Architecture)'

A reinforced soil wall with a proven track record of absorbing large-scale impacts using reinforced soil.

The "Geo-Lock Wall" is a reinforced earth wall designed to absorb falling rocks, landslides, and collapsing soil, primarily along roadsides and behind residential houses. It can withstand rockfall energy of up to 5500 kJ and is utilized for a wide range of rockfall countermeasures from small to large scale. It primarily uses soil and geosynthetics as materials. Due to the unique flexible structure of soil structures, it efficiently absorbs impacts and can handle large-scale impact energy. Because it is a soil structure, it can be installed in various terrains, including sites with limited installation space, sites with vertical gradients, and sites with valley topography. Additionally, it does not transmit impact forces to the supporting ground, so in most cases, ground improvement treatments are not necessary. ■ Rockfall, landslide, and collapsing soil countermeasures using reinforced earth ■ Capable of withstanding rockfall energy up to 5500 kJ ■ Available in three types according to the scale of rockfall ■ Over 540 adoption records nationwide Ministry of Land, Infrastructure, Transport and Tourism New Technology Information System (NETIS) Registration Number: HR-990009-V *Registration period has ended NETIS Fiscal Year 2016 Semi-Recommendation Technology *For more details, please download the PDF or feel free to contact us.

• Road construction
• Railway Construction
• Retaining wall

A groundbreaking method to protect against snow collapse using nets, which can be installed in narrow spaces.

The "Slope Guard Net Type S" is a snow avalanche protection net that accumulates snow cornices that fall from collapsing snow or avalanche prevention fences on steep slopes into its pocket area, protecting roads and houses from snowfalls. In conventional snow collapse measures, when using concrete structures, it was necessary to excavate a large amount of the slope. The Slope Guard Net Type S has an anchor foundation structure, which requires less excavation of the slope, making it superior in terms of cost-effectiveness, constructability, and environmental impact. ■ Measures against collapsing snow and snow cornices near roads ■ Accumulating snow that spills from steep slopes into the pocket area Ministry of Land, Infrastructure, Transport and Tourism New Technology Information System (NETIS) Registration Number: HR-190002-A *For more details, please download the PDF or feel free to contact us.

• Road construction
• Railway Construction
• Other civil engineering works

In the field of food and health food research and development, an increasing number of companies are facing the following challenges: - Difficulty in exploring new functional materials and differentiation themes, leading to a depletion of research topics. - While they are collecting information from conferences and papers, they struggle to translate this into research themes directly related to their products. - They remain limited to competing similar products and follow-up projects, failing to establish uniqueness. - Although there are seeds of ideas, they struggle to elevate them to scientific hypotheses and build the necessary foundations for internal approval. Behind this lies a "wall of execution" that cannot be overcome by traditional information gathering and research processes. In this webinar, we will introduce a new R&D approach to break through these challenges. It is a next-generation research and development scheme that combines AI-driven hypothesis generation, which has achieved results in drug discovery, with scientific hypothesis verification by a food human trial CRO. This will allow for the transformation of vague ideas into scientifically verifiable projects, simultaneously achieving the construction of persuasive foundations for upper management and differentiation development.

Fujikohsuhou Industrial Co., Ltd. will hold an online seminar titled "Tips for Setting Laser Hardening Conditions" on July 20, 2025 (Wednesday). In laser hardening, factors such as output and speed are related to the quality of hardening. We will explain how output and speed are connected to quality factors. This seminar is aimed at those who are looking to start utilizing laser hardening. 【Recommended for】 ■ Those who want to learn about methods for setting laser hardening conditions ■ Those who want to obtain technical information about laser hardening

Take the 'first step' in DX talent development in Fukuoka. We will hold a free seminar where you can learn reskilling strategies that can be applied in the field through case studies and experiences! 'I've become responsible for DX, but I don't know where to start.' This is a participatory seminar aimed at representatives from small and medium-sized enterprises in Fukuoka City, Fukuoka Prefecture, where you can learn the 'first steps' in DX talent development and implementation support. While introducing case studies of representative DX tools such as Power Automate and Power BI, you will experience hands-on sessions with Copilot, allowing you to grasp practical small-start methods that can be implemented on-site. The content also includes specific success stories from the Fukuoka region, along with tips for promoting understanding and advancement within your organization.

We will be exhibiting at INCHEM TOKYO 2025, which will be held at Tokyo Big Sight from September 17 (Wednesday) to September 19 (Friday). This time, we will host many events, including special project stages and mini-seminars. At our booth, we will introduce our solutions and technologies based on the theme of "Sustainable Plant Engineering" from three different concepts. Please be sure to stop by our booth, East Hall 6, K-17.

The Siemens EDA Tech Forum is a technical event aimed at sharing the latest technological trends, case studies, and solutions to challenges with everyone involved in the design and development of silicon systems and electronic systems, while addressing evolving technologies, the densification and complexity of designs, and various design challenges, all while meeting requirements for quality, safety, and reliability. The goal is to deepen insights and networks towards achieving sustainable business. The forum covers a wide range of topics, from advanced design technologies and methods in fields such as 3D ICs, chiplets, chips for AI and ML (machine learning), and IC packaging, to the design, analysis, and collaborative development of electronic systems, including printed circuit boards, across multiple domains, as well as building ecosystems both internally and externally using digital threads. Through case presentations and explanations of design methods by industry leaders, it supports solutions to challenges faced in daily design work from all directions. This is a free technical event that requires pre-registration. We hope you will participate!