Measurement of Load in Metal Processing - Development of a Compact X-ray Device by Pulse Tech - Published in the Shizuoka Edition of the Nihon Keizai Shimbun on May 12, 2012.

On the 11th, Pulsatech Industries announced the development of a compact X-ray device that measures the load applied when bending materials such as iron. The device has been streamlined for portability, making it easy to use in outdoor and factory work environments. It will be marketed to processing companies, such as parts manufacturers, for product quality inspections and regular inspections. The price, including the power supply, is set between 7 to 8 million yen, with a goal of selling 30 units in the first year.
The developed device measures the stress, which refers to the load remaining in the metal during processing. Weighing 3.5 kilograms, it measures stress by directing X-rays at the metal and measuring the angle of reflection. Sales will begin on June 1.
When bent metal is used for an extended period, the stress balance can be disrupted due to surface wear, leading to cracks and other issues, necessitating stress adjustments or part replacements. Traditionally, measurements were cumbersome as they required large equipment.

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