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  4. Exhibiting at SEMICON Japan 2024 - Sain Japan Co., Ltd.
SEMINAR_EVENT
  • Nov 07, 2024
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Nov 07, 2024

Exhibiting at SEMICON Japan 2024 - Sain Japan Co., Ltd.

セインジャパン セインジャパン
We will be exhibiting at "SEMICON Japan" held at Tokyo Big Sight. To improve the cooling efficiency of the entire system, it is important to select high-performance couplings with low pressure loss. Sain's quick couplings ensure the safety of equipment with "leak-free separation and high flow characteristics," maximizing the performance of chillers. At this exhibition, we will showcase "Ultra Flow SC," "Ultra Flow STC," and "UQD Couplings," which feature low pressure loss and high flow rates, as well as quick couplings capable of operating in ultra-low temperature environments as reference exhibits. Please be sure to visit our booth. "SEMICON Japan" ◆ Dates: December 11 (Wednesday) - 13 (Friday), 2024, 10:00 - 17:00 ◆ Venue: Tokyo Big Sight, East Hall 1 ◆ Booth Number: 1429
Date and time Wednesday, Dec 11, 2024 ~ Friday, Dec 13, 2024
10:00 AM ~ 05:00 PM
Capital Tokyo Big Sight, East Hall 1, Booth #1429
Entry fee Free Pre-registration is required.
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ultraFLOW-Semiconductor-Grp-CEJN.jpg

Ultra Flow SC Quick Coupling for Semiconductor Manufacturing

A stainless steel coupling developed specifically for liquid cooling systems used in semiconductor manufacturing processes.

The Sain Ultra Flow SC is a special version of the Ultra Flow with a screw connection or double ferrule tube fitting. It is specially designed for liquid cooling systems used in semiconductor manufacturing processes and is made of stainless steel. Its flat-face design prevents liquid dripping during attachment and detachment, effectively preventing contamination in clean environments and leakage of refrigerants with high global warming potential. Additionally, its low pressure loss and high flow characteristics contribute to improving the overall energy efficiency of the system.

  • Heat exchanger

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Blind Mate Auto Coupling

Minimal air intrusion and leak-free attachment and detachment. Compact auto-coupling suitable for integration into server racks.

Designed for thermal management applications that require minimal air ingress and leak-free attachment and detachment. The unique design prevents damage to seals during attachment and detachment under pressure, ensuring a highly airtight fit. Automatic alignment features enable blind connections. Made from durable and corrosion-resistant stainless steel and hardened anodized aluminum alloy. The temperature range for the specially developed nitrile (NBR) seals in this series is -40°C to 80°C. EPDM seals are also available.

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group-153-uqd-cejn.jpg

UQD coupling for data center liquid cooling

Universal standard for high-efficiency quick disconnects for liquid cooling systems.

The Universal Quick Disconnect (UQD) was developed as a global standard for quick disconnect couplings within the Open Compute Project (OPC). UQD is an open standard for leak-free quick couplings for data center liquid cooling, developed under the leadership of Intel. Being an open standard, any manufacturer's products can be connected as long as they comply with the UQD specification. With years of experience in providing high-quality quick connect couplings that meet a wide range of applications through precise manufacturing, our UQD couplings not only comply with the standard but exceed its specifications.

  • Other Batteries

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Smart Flow Drive Lake Coupling

TEAM SPEC / Compliant with STANAG 3756, no liquid leakage. Coupling for liquid transfer.

Smart Flow Drive Lake Couplings are designed to support safe, efficient, and environmentally friendly fluid transfer in harsh environments where safety is a priority. With minimal components and no need for additional valves, they allow for leak-free connections and disconnections, saving both time and costs. They are commonly used in AdBlue distribution, road and rail tankers, offshore applications, marine bunkering, and IBC filling. Smart Flow Couplings feature a safety factor of five times the operating pressure of 2.5 MPa, regardless of size or material. This is unique in the industry, and for applications requiring higher pressures, you can choose Smart Flow aluminum units as a lighter and more cost-effective alternative to competitors' stainless steel units. Compliance with TEAM SPEC and STANAG 3756 standards ensures compatibility with products from other manufacturers. Additionally, FDA-approved O-rings are available to meet the stringent safety and hygiene standards required for use in food and beverage manufacturing.

  • Other Batteries

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Ultra Flow Coupling & Nipple

Coupling for chiller piping of semiconductor manufacturing equipment.

The key to successful thermal management is operational time and reliability. Therefore, high-quality products designed to ensure long-term reliability are necessary. UltraFlow is a quick coupling for liquid-cooled high-performance electronics, featuring a flat face design that prevents liquid leakage and offers excellent durability. It achieves improved lifespan of cooling systems and reduced running costs with high flow characteristics and low pressure loss.

  • Other Batteries

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987-DN32-STC-DOF-CEJN.jpg

Ultra Flow STC Coupling & Nipple

Screw-type connection coupling for cooling water circulation devices (CDU)

The Ultra Flow STC Screw-to-Connect Coupling is a large-diameter version of the Ultra Flow series that prevents liquid dripping. Due to its large diameter and high flow rate, significant force is required for connection; however, the Ultra Flow STC overcomes this by using a screw-in design, making it easy to connect. Like other products in the Ultra Flow series, it features excellent characteristics such as high durability, extremely low pressure loss, and no liquid dripping. By combining our years of experience in drip-free hydraulic couplings with new technology in liquid cooling, we have created an efficient quick-connect coupling based on a proven design.

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Non-Drip%20Valve.jpg

Water cooling and various liquids one-touch fittings / non-drip couplings

● No liquid leakage ● Three safety features available as options ● Usable up to 315℃

The Sain water and various liquid non-drip coupling can be connected with a simple one-touch action (just push the nipple into the coupling), and thanks to its unique valve design, there is absolutely no liquid leakage during disconnection. Additionally, if safety is a concern, three types of safety features are available as options: 1. Color coding for easy identification of liquids and pressure, 2. Key codes to prevent incorrect port connections, and 3. A safety lock mechanism to prevent unexpected disconnections. By choosing Calretz as the sealing material, it can be used at temperatures up to 315°C. Furthermore, upon request, couplings and nipples without built-in valves can also be used as standard.

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Related catalog(6)

"Ultra Flow" coupling for chiller piping in semiconductor manufacturing equipment.

"Ultra Flow" coupling for chiller piping in semiconductor manufacturing equipment.

PRODUCT
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Thermal management blind mate coupling "DLC Series"

Thermal management blind mate coupling "DLC Series"

PRODUCT
  • E-book viewing
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Ultra Flow Coupling for Chillers - High Flow Rate and Low Pressure Loss

Ultra Flow Coupling for Chillers - High Flow Rate and Low Pressure Loss

PRODUCT
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Smart Flow Drive Lake Coupling

Smart Flow Drive Lake Coupling

PRODUCT
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Comprehensive Catalog of Thermal Control Products: Liquid Cooling Couplings

Comprehensive Catalog of Thermal Control Products: Liquid Cooling Couplings

CATALOG
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Sein Product General Catalog: Couplings, Hoses, Accessories

Sein Product General Catalog: Couplings, Hoses, Accessories

CATALOG
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Exhibition at BREX Kansai

  • NEW
  • SEMINAR_EVENT

We are pleased to announce that Gywood has been recommended as a featured building material in the special project "Recommended Building Materials" at the Housing Business Fair within the comprehensive exhibition for housing, architecture, and real estate [BREX Kansai]. We will be exhibiting in the "Recommended Building Materials and Equipment" zone, where professionals from the field gather to showcase their recommended materials. We invite everyone to stop by and visit us.

Oct 26, 2026

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The latest techniques for utilizing robots to reduce "waste" in factories!

  • NEW
  • SEMINAR_EVENT

Seminar Overview As the labor shortage in manufacturing sites becomes more severe, the labor costs and time losses associated with the "transportation" of products and components, as well as "cleaning" within factories, have become critical management issues that cannot be overlooked. In this webinar, we will introduce the latest use cases of "Autonomous Mobile Robots (AMR)" and "Commercial Cleaning Robots" that achieve productivity improvements in manufacturing environments. We will specifically address questions such as "How are other companies operating these technologies?" and "What kind of cost reduction effects can be expected after implementation?" by providing concrete explanations of actual before-and-after scenarios and operational flows. Factory managers and members of production technology and DX promotion departments who want to advance automation and efficiency on-site are encouraged to participate! Recommended for: - Those who are unsure about where to start with automation, labor reduction, and DX in their factories. - Those who want to alleviate labor shortages on-site and focus resources on core operations to improve productivity. - Those who want to stay updated on the latest trends in the use of transportation robots (AMR) and cleaning robots.

Oct 26, 2026

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【paperlogic】November 27 (Thursday) | A seminar on successfully utilizing AI. Learning about reliable data infrastructure and practical know-how.

  • NEW
  • SEMINAR_EVENT

Our representative, Koichi Yokoyama, will be speaking at an online seminar scheduled for November 27 (Friday). Participation is possible from anywhere in the country. We hope you will join us! 【Event Overview】 Date: November 27, 2026 (Friday) 13:00 - 15:05 (Deadline: November 25, 17:00) Venue: Online (Zoom) / Participation Fee: Free (Pre-registration required, lottery system) Organizer: Otsuka Shokai Co., Ltd. 【Session Details (14:05 - 14:35)】 "What Does Reliable Data Creation Mean? - Insights from Certified Public Accountants and Tax Accountants on Creating Trustworthy Data Before Relying on AI" We will discuss the quality and reliability of data that influences AI outcomes, covering points such as "Considerations for Practicing DX" and "Data Integrity and Authenticity" from the perspectives of certified public accountants and tax accountants, to lay the groundwork for safely utilizing AI. *Applications from competitors or similar industries may be declined. *Inquiries: Otsuka Shokai Co., Ltd. Seminar Office (ai-datasuishin@otsuka-shokai.co.jp)

Oct 26, 2026

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The situation of the Niigata event.

Notice of the Glass Foam Recycling Material Technology Seminar to be held on February 12, 2027 (Friday) [Miyagi Prefecture]

  • NEW
  • SEMINAR_EVENT

We will hold the first technical seminar on lightweight embankment construction methods and glass foam recycled materials in Sendai City, Miyagi Prefecture. Registration is limited to the first 126 applicants. "Technical Seminar on Lightweight Embankment Construction Methods and Glass Foam Recycled Materials" 【Program】 1. Lightweight Embankment Construction Method (1) What is lightweight embankment material? (2) Information on lightweight embankment materials (3) Application range (4) Construction achievements (5) Workability 2. Glass Foam Recycled Materials (1) What are glass foam recycled materials? (2) Features (3) Design soil constants (4) Considerations for design and construction (5) Application examples On February 12, 2027 (Friday), the "Technical Seminar on Lightweight Embankment Construction Methods and Glass Foam Recycled Materials" will be held at the Sendai Conference Center, 8th Floor, 2-2-10 Chuo, Aoba-ku, Sendai City, Miyagi Prefecture, as a CPD accredited program by the Japan Society of Civil Engineers (2.7 units). As there are only 126 spots available, please register early. For details and registration, please refer to the attached file.

Oct 24, 2026

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Notice of Participation in "EdgeTech+2026" from November 18 (Wednesday) to November 20 (Friday), 2026.

  • NEW
  • SEMINAR_EVENT

CIC Corporation will be exhibiting at 'EdgeTech+2026' held at Pacifico Yokohama. At the CIC booth, we will showcase the meter remote automatic reading system [XQC series] with actual equipment. We sincerely look forward to your visit.

Oct 23, 2026

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