Oji Tack and Shintack Kasei will jointly exhibit at the 'Label Forum Japan 2024'.

This is a semi-transparent paper tack that is environmentally friendly. It can serve as an alternative to plastic and transparent film tacks, contributing to a reduction in plastic usage!

Semi-Transparent Thermal Tack Paper "Semi-Sura Tack" is a tack paper that can be an environmentally friendly alternative from transparent film to paper. <Features> ◆ Made from thermosensitive materials, it allows for on-demand printing. ◆ Despite being paper-based, it is semi-transparent and allows the background to show through. ◆ The semi-transparent quality enhances a sense of luxury and makes it easy to check the contents.

• others
• Office supplies and stationery
• Laminator

The environmentally friendly products of Shinta Tack Kasei, the Handy Eco Tack series, have been expanded with the addition of the "Flap Label Tack."

A flap label that can be repeatedly opened and closed for use when taking out contents such as wet wipes from pillow packaging, as well as to protect the contents from drying out. As part of our commitment to environmental considerations, we will begin selling flap label backing paper made from environmentally friendly materials. <Features> ◆ The base material is made from recycled PET bottle materials, including transparent PET, white PET, and water-repellent paper, contributing to reduced environmental impact. ◆ The adhesive is a special re-peelable type that can be repeatedly applied and removed from various pillow packaging. ◆ The release paper is made of glassine paper suitable for labelers.

• Packaging materials

Environmentally friendly tack paper using recyclable adhesive along with old paper.

- We have made it possible to collect paper tags, which were previously prohibited items in paper recycling, together with regular waste paper and use them (disperse them). - We use water-dispersible adhesives. They lose their adhesive properties in water and disperse evenly, making paper recycling possible.

• Label printer

It is a water-resistant eco-friendly tack paper, despite being a paper label! It is a product that takes the Earth's environment into consideration.

This is an eco-friendly tack paper that uses "OK Rain Guard" (manufactured by Oji Fitec), which has excellent water resistance while being made of paper labels. <Features> ◆ It looks like high-quality paper, yet it repels water and is strong against moisture. ◆ Promotes the alternative use of film labels, contributing to environmental measures!

• Medicines
• Safety and consumables
• Packaging Machines

In the field of food and health food research and development, an increasing number of companies are facing the following challenges: - Difficulty in exploring new functional materials and differentiation themes, leading to a depletion of research topics. - While they are collecting information from conferences and papers, they struggle to translate this into research themes directly related to their products. - They remain limited to competing similar products and follow-up projects, failing to establish uniqueness. - Although there are seeds of ideas, they struggle to elevate them to scientific hypotheses and build the necessary foundations for internal approval. Behind this lies a "wall of execution" that cannot be overcome by traditional information gathering and research processes. In this webinar, we will introduce a new R&D approach to break through these challenges. It is a next-generation research and development scheme that combines AI-driven hypothesis generation, which has achieved results in drug discovery, with scientific hypothesis verification by a food human trial CRO. This will allow for the transformation of vague ideas into scientifically verifiable projects, simultaneously achieving the construction of persuasive foundations for upper management and differentiation development.

Fujikohsuhou Industrial Co., Ltd. will hold an online seminar titled "Tips for Setting Laser Hardening Conditions" on July 20, 2025 (Wednesday). In laser hardening, factors such as output and speed are related to the quality of hardening. We will explain how output and speed are connected to quality factors. This seminar is aimed at those who are looking to start utilizing laser hardening. 【Recommended for】 ■ Those who want to learn about methods for setting laser hardening conditions ■ Those who want to obtain technical information about laser hardening

Take the 'first step' in DX talent development in Fukuoka. We will hold a free seminar where you can learn reskilling strategies that can be applied in the field through case studies and experiences! 'I've become responsible for DX, but I don't know where to start.' This is a participatory seminar aimed at representatives from small and medium-sized enterprises in Fukuoka City, Fukuoka Prefecture, where you can learn the 'first steps' in DX talent development and implementation support. While introducing case studies of representative DX tools such as Power Automate and Power BI, you will experience hands-on sessions with Copilot, allowing you to grasp practical small-start methods that can be implemented on-site. The content also includes specific success stories from the Fukuoka region, along with tips for promoting understanding and advancement within your organization.

We will be exhibiting at INCHEM TOKYO 2025, which will be held at Tokyo Big Sight from September 17 (Wednesday) to September 19 (Friday). This time, we will host many events, including special project stages and mini-seminars. At our booth, we will introduce our solutions and technologies based on the theme of "Sustainable Plant Engineering" from three different concepts. Please be sure to stop by our booth, East Hall 6, K-17.

The Siemens EDA Tech Forum is a technical event aimed at sharing the latest technological trends, case studies, and solutions to challenges with everyone involved in the design and development of silicon systems and electronic systems, while addressing evolving technologies, the densification and complexity of designs, and various design challenges, all while meeting requirements for quality, safety, and reliability. The goal is to deepen insights and networks towards achieving sustainable business. The forum covers a wide range of topics, from advanced design technologies and methods in fields such as 3D ICs, chiplets, chips for AI and ML (machine learning), and IC packaging, to the design, analysis, and collaborative development of electronic systems, including printed circuit boards, across multiple domains, as well as building ecosystems both internally and externally using digital threads. Through case presentations and explanations of design methods by industry leaders, it supports solutions to challenges faced in daily design work from all directions. This is a free technical event that requires pre-registration. We hope you will participate!