Notice of Joint Research Report and Seminar Presentation with Ehime University (JPCA Show 2024 / 2024 Microelectronics Show)

This is a flagship model that arranges probe heads above and below, enabling simultaneous in-circuit testing of both sides of the substrate.

Four probes are arranged on the top side of the substrate and two on the bottom side. Each probe can move freely and at high speed, achieving an astonishing inspection speed that is world-class in standard. By using the upper and lower flying probes simultaneously, a combination inspection of up to six probes allows for simultaneous contact inspection at both points on the top and bottom sides of the substrate. This significantly expands the inspection range and further accelerates inspection time. It is equipped with a wealth of features and boasts world-class standards in speed and positioning accuracy. ★You can bring your substrate to our demo room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

Programming for FPGAs and special performance tests such as BST can be handled with a flying probe tester.

This is an option that equips the underside operating axis of the APT-1600FD series with a dedicated fixture lifting mechanism. It allows for special inspections connected to external devices, such as Boundary Scan Testing (BST), as well as writing to and reading logs from ICs, to be performed in parallel with in-circuit testing. *Please refer to the YouTube video for an image of the operation.

• Measurement and Inspection

The Takaya APT series is a board inspection device capable of industry-leading ultra-high-speed in-circuit testing.

One method for efficiently mass-producing products is the "line production method," which arranges machinery in order of the production process. This method excels in the productivity of single products and is adopted in many manufacturing sites. The incorporation of inspection processes into this line production method is referred to as "inline inspection." Takaya's flying probe testers have models that can accommodate this "inline inspection" by automatically transporting circuit boards on a conveyor. By collaborating with loaders, unloaders, and inverters through SMEMA, it enables automated and unmanned inspection even for large quantities of circuit boards. Additionally, by using it in conjunction with other companies' 3D AOI (automated optical inspection machines), the flying probe tester can detect issues such as microbridges that cannot be identified through visual inspection alone. This approach leverages the strengths of each system, resulting in the elimination of false positives, improved inspection capabilities, and increased speed. If you are facing challenges with full electrical inspection (ICT) of mass-produced circuit boards, please consider Takaya's APT series, which allows for easy line switching without the need for fixtures.

• Measurement and Inspection

Exhibiting at Nepcon 2024 from January 24! Achieving interoperability between industrial equipment and MES systems!

OPC UA (OPC Unified Architecture) is an open international standard developed for safe and reliable data exchange in industries such as industrial automation. It was announced by the OPC Foundation in 2008 and later standardized as IEC62541. It enables secure and highly reliable data exchange across various types of devices, operating systems, and manufacturers, making it recommended as the standard communication for Industrie 4.0 and increasingly adopted worldwide. Additionally, it is aligned with the international standard for PLCs, IEC61131-3, providing the advantage of high reliability in exchanging information from the manufacturing site with higher-level monitoring control systems and Manufacturing Execution Systems (MES). In response to this trend, Takaya has prepared an option to equip the APT series of flying probe testers with an OPC UA server. We are working to promote the adoption of industrial IoT standards that bridge FA equipment and IT.

• Measurement and Inspection

The housing industry is currently facing a significant turning point due to factors such as population decline, a reduction in demand for new construction, and intensified price competition. This seminar will clearly explain the "business model transformation strategies" necessary for construction companies to survive and continue to grow in such a challenging environment. We will introduce specific approaches that can be immediately applied on-site, along with a roadmap to success.

Nitto Kohki will hold the "2025 Attack Fair in Meiko" for two days from July 23 (Wednesday) to July 24 (Thursday), 2025, at the "Kowa Seminar Plaza 2F Training Room No. 12 (inside Kowa Sports Land)." The Attack Fair is an exhibition where you can actually "see, touch, and operate" Nitto Kohki's products. Additionally, there will be wonderful souvenirs for attendees and many fun activities prepared. We look forward to welcoming everyone!

ODS Corporation, a manufacturer of business information terminals (headquartered in Chiyoda-ku, Tokyo, President: Kiyoshi Sunanaga), in collaboration with Magconn Corporation (headquartered in Kokubunji City, Tokyo, President: Satoshi Inoue), will showcase its business tablets at the "HCJ2026 International Hotel and Restaurant Show" to be held at Tokyo Big Sight from February 17 (Tuesday) to 20 (Friday), 2026. We will present the Android model "TA2C-NF8" equipped with an NFC reader/writer, which can be utilized in restaurants and hotels, as well as the Windows model "TW2A-NF9LTA" with an NFC reader/writer, which will be unveiled for the first time at this exhibition and is scheduled for release in March. By combining these products with Magconn's charging system, which allows for stable charging with a one-touch magnetic attachment, we aim to propose improvements in operational efficiency and the creation of new business opportunities utilizing NFC solutions.

The Practical Solution Fair is one of Japan's largest IT comprehensive exhibitions, hosted by Otsuka Shokai, held once a year. This year's theme is "Expanding with AI! Complete DX." The venue will showcase the latest business efficiency tools utilizing AI, and Paperlogic will exhibit "Electronic Contracts" and "Construction Document DX Pocket." ■ Date February 18, 2026 (Wednesday) 10:00 AM - 5:00 PM (last entry) February 19, 2026 (Thursday) 9:30 AM - 5:00 PM (last entry) Applications for attendance are accepted until 5 PM on each day. ■ Venue Grand Cube Osaka (Osaka Prefectural International Conference Hall): 5-3-51 Nakanoshima, Kita Ward, Osaka City, Osaka Prefecture ■ Participation method: Free, registration required https://it-event.otsuka-shokai.co.jp/osaka/ ▼ For details on the Tokyo venue, click here https://note.com/paperlogic/n/nb096d59149dc

We will be exhibiting at "JAPAN SHOP 2026," which will be held at Tokyo Big Sight from March 3 (Tuesday) to March 6 (Friday), 2026.