Notice of Joint Research Report and Seminar Presentation with Ehime University (JPCA Show 2024 / 2024 Microelectronics Show)

This is a flagship model that arranges probe heads above and below, enabling simultaneous in-circuit testing of both sides of the substrate.

Four probes are arranged on the top side of the substrate and two on the bottom side. Each probe can move freely and at high speed, achieving an astonishing inspection speed that is world-class in standard. By using the upper and lower flying probes simultaneously, a combination inspection of up to six probes allows for simultaneous contact inspection at both points on the top and bottom sides of the substrate. This significantly expands the inspection range and further accelerates inspection time. It is equipped with a wealth of features and boasts world-class standards in speed and positioning accuracy. ★You can bring your substrate to our demo room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

Programming for FPGAs and special performance tests such as BST can be handled with a flying probe tester.

This is an option that equips the underside operating axis of the APT-1600FD series with a dedicated fixture lifting mechanism. It allows for special inspections connected to external devices, such as Boundary Scan Testing (BST), as well as writing to and reading logs from ICs, to be performed in parallel with in-circuit testing. *Please refer to the YouTube video for an image of the operation.

• Measurement and Inspection

The Takaya APT series is a board inspection device capable of industry-leading ultra-high-speed in-circuit testing.

One method for efficiently mass-producing products is the "line production method," which arranges machinery in order of the production process. This method excels in the productivity of single products and is adopted in many manufacturing sites. The incorporation of inspection processes into this line production method is referred to as "inline inspection." Takaya's flying probe testers have models that can accommodate this "inline inspection" by automatically transporting circuit boards on a conveyor. By collaborating with loaders, unloaders, and inverters through SMEMA, it enables automated and unmanned inspection even for large quantities of circuit boards. Additionally, by using it in conjunction with other companies' 3D AOI (automated optical inspection machines), the flying probe tester can detect issues such as microbridges that cannot be identified through visual inspection alone. This approach leverages the strengths of each system, resulting in the elimination of false positives, improved inspection capabilities, and increased speed. If you are facing challenges with full electrical inspection (ICT) of mass-produced circuit boards, please consider Takaya's APT series, which allows for easy line switching without the need for fixtures.

• Measurement and Inspection

Exhibiting at Nepcon 2024 from January 24! Achieving interoperability between industrial equipment and MES systems!

OPC UA (OPC Unified Architecture) is an open international standard developed for safe and reliable data exchange in industries such as industrial automation. It was announced by the OPC Foundation in 2008 and later standardized as IEC62541. It enables secure and highly reliable data exchange across various types of devices, operating systems, and manufacturers, making it recommended as the standard communication for Industrie 4.0 and increasingly adopted worldwide. Additionally, it is aligned with the international standard for PLCs, IEC61131-3, providing the advantage of high reliability in exchanging information from the manufacturing site with higher-level monitoring control systems and Manufacturing Execution Systems (MES). In response to this trend, Takaya has prepared an option to equip the APT series of flying probe testers with an OPC UA server. We are working to promote the adoption of industrial IoT standards that bridge FA equipment and IT.

• Measurement and Inspection

In the field of food and health food research and development, an increasing number of companies are facing the following challenges: - Difficulty in exploring new functional materials and differentiation themes, leading to a depletion of research topics. - While they are collecting information from conferences and papers, they struggle to translate this into research themes directly related to their products. - They remain limited to competing similar products and follow-up projects, failing to establish uniqueness. - Although there are seeds of ideas, they struggle to elevate them to scientific hypotheses and build the necessary foundations for internal approval. Behind this lies a "wall of execution" that cannot be overcome by traditional information gathering and research processes. In this webinar, we will introduce a new R&D approach to break through these challenges. It is a next-generation research and development scheme that combines AI-driven hypothesis generation, which has achieved results in drug discovery, with scientific hypothesis verification by a food human trial CRO. This will allow for the transformation of vague ideas into scientifically verifiable projects, simultaneously achieving the construction of persuasive foundations for upper management and differentiation development.

Fujikohsuhou Industrial Co., Ltd. will hold an online seminar titled "Tips for Setting Laser Hardening Conditions" on July 20, 2025 (Wednesday). In laser hardening, factors such as output and speed are related to the quality of hardening. We will explain how output and speed are connected to quality factors. This seminar is aimed at those who are looking to start utilizing laser hardening. 【Recommended for】 ■ Those who want to learn about methods for setting laser hardening conditions ■ Those who want to obtain technical information about laser hardening

Take the 'first step' in DX talent development in Fukuoka. We will hold a free seminar where you can learn reskilling strategies that can be applied in the field through case studies and experiences! 'I've become responsible for DX, but I don't know where to start.' This is a participatory seminar aimed at representatives from small and medium-sized enterprises in Fukuoka City, Fukuoka Prefecture, where you can learn the 'first steps' in DX talent development and implementation support. While introducing case studies of representative DX tools such as Power Automate and Power BI, you will experience hands-on sessions with Copilot, allowing you to grasp practical small-start methods that can be implemented on-site. The content also includes specific success stories from the Fukuoka region, along with tips for promoting understanding and advancement within your organization.

We will be exhibiting at INCHEM TOKYO 2025, which will be held at Tokyo Big Sight from September 17 (Wednesday) to September 19 (Friday). This time, we will host many events, including special project stages and mini-seminars. At our booth, we will introduce our solutions and technologies based on the theme of "Sustainable Plant Engineering" from three different concepts. Please be sure to stop by our booth, East Hall 6, K-17.

The Siemens EDA Tech Forum is a technical event aimed at sharing the latest technological trends, case studies, and solutions to challenges with everyone involved in the design and development of silicon systems and electronic systems, while addressing evolving technologies, the densification and complexity of designs, and various design challenges, all while meeting requirements for quality, safety, and reliability. The goal is to deepen insights and networks towards achieving sustainable business. The forum covers a wide range of topics, from advanced design technologies and methods in fields such as 3D ICs, chiplets, chips for AI and ML (machine learning), and IC packaging, to the design, analysis, and collaborative development of electronic systems, including printed circuit boards, across multiple domains, as well as building ecosystems both internally and externally using digital threads. Through case presentations and explanations of design methods by industry leaders, it supports solutions to challenges faced in daily design work from all directions. This is a free technical event that requires pre-registration. We hope you will participate!