【FerRobotics】Exhibiting at the 2023 International Robot Exhibition! Displaying multiple types of robotic systems for polishing automation solutions! Achieving the automation of skilled tasks in polishing and grinding, which were previously deemed impossible, along with reduced cycle times and high-quality finishes.

Dramatic improvement in cycle time. Solutions to the hiring issues of skilled workers and 3K workers. Reduction in costs of consumables and abrasives. Automation of polishing with high-speed autonomous correction control of contact force!

FerRobotics' Active Compliant Technology automatically corrects the "difference" in contact pressure (force) that occurs during polishing and grinding processes, which require skilled techniques, at high speed. This technology allows for consistent polishing/grinding at a set contact force, unaffected by variations in processing speed or gravitational load differences due to angles. With the end effector (ACF) utilizing ACT technology, it instantly and automatically adjusts to changes in the dimensional tolerances, curved shapes, and non-flat surfaces of the workpiece by rapidly extending and retracting the stroke, maintaining contact with the workpiece at the set force. This technology can increase the speed of devices and robots' trajectories, thereby enhancing processing speed and improving cycle times. Additionally, in robotic polishing and grinding, the ACF controls the contact pressure through the extension and retraction of its stroke, eliminating the need to move the heavy robot arm for corrections, which further assists in improving the processing speed of robotic polishing. Moreover, since it automatically corrects for tool load changes due to gravity based on the robot's angle, it consistently maintains uniform contact pressure from any angle, enabling a finish without processing inconsistencies.

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Weld bead removal and complete automation from rough cutting to finishing polishing can be achieved with a single machine. With the integration of a tool exchange system and high-speed autonomous pressure correction technology, full automation is possible!

Equipped with an auto tool changer function, the pressing force high-speed autonomous correction technology achieves a reduction in cycle time for skilled operations and complete automation of high-quality finishing. Using ACT technology, the end effector autonomously corrects the force applied to the workpiece in response to variations in dimensions and warping by adjusting the stroke instantaneously, maintaining contact with the set force. Additionally, gravity compensation is performed autonomously, ensuring a consistent pressing force from any angle, and allowing for easy settings to maintain finishing quality on R-shaped workpieces. This technology enables the robot to maintain a constant contact force even when increasing the trajectory speed, improving cycle time and achieving high-quality finishing with high repeatability. Furthermore, automation allows for increased pressing force and reduces the frequency of changing abrasive grits by maintaining a consistent force, significantly contributing to the extension of abrasive lifespan and reduction of running costs. The tool holder accommodates almost all types of polishing tools, from grinders to double-action sanders and brushing tools. It also allows for control of motor rotation speed in 10 rpm increments, broadening the scope of automation in polishing tasks. Additionally, it supports an auto paper changer.

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Automation of labor-intensive R-shaped and complex masking tasks without wrinkles or bubbles. Enabling automation of processes that were previously impossible, with high-speed operations.

This product makes it possible to automate masking and taping tasks that were previously impossible. FerRobotics' Active Compliant Technology (ACT) automatically corrects the "difference" in contact pressure (force) at high speed, allowing it to maintain contact with the target object at a constant applied force, regardless of fast processing speeds or variations in gravitational load due to angles. With the end effector (ATK) utilizing this technology, taping and masking tasks can be finished with the highest quality, free of wrinkles and bubbles. It also allows for increased robot speed, enhancing work speed and improving cycle time. The tool load, which varies due to gravity depending on the robot's angle, is automatically corrected, ensuring a consistent applied pressure from any angle, enabling high-quality taping with high repeatability even on R-shaped and complex geometries.

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In the field of food and health food research and development, an increasing number of companies are facing the following challenges: - Difficulty in exploring new functional materials and differentiation themes, leading to a depletion of research topics. - While they are collecting information from conferences and papers, they struggle to translate this into research themes directly related to their products. - They remain limited to competing similar products and follow-up projects, failing to establish uniqueness. - Although there are seeds of ideas, they struggle to elevate them to scientific hypotheses and build the necessary foundations for internal approval. Behind this lies a "wall of execution" that cannot be overcome by traditional information gathering and research processes. In this webinar, we will introduce a new R&D approach to break through these challenges. It is a next-generation research and development scheme that combines AI-driven hypothesis generation, which has achieved results in drug discovery, with scientific hypothesis verification by a food human trial CRO. This will allow for the transformation of vague ideas into scientifically verifiable projects, simultaneously achieving the construction of persuasive foundations for upper management and differentiation development.

Fujikohsuhou Industrial Co., Ltd. will hold an online seminar titled "Tips for Setting Laser Hardening Conditions" on July 20, 2025 (Wednesday). In laser hardening, factors such as output and speed are related to the quality of hardening. We will explain how output and speed are connected to quality factors. This seminar is aimed at those who are looking to start utilizing laser hardening. 【Recommended for】 ■ Those who want to learn about methods for setting laser hardening conditions ■ Those who want to obtain technical information about laser hardening

Take the 'first step' in DX talent development in Fukuoka. We will hold a free seminar where you can learn reskilling strategies that can be applied in the field through case studies and experiences! 'I've become responsible for DX, but I don't know where to start.' This is a participatory seminar aimed at representatives from small and medium-sized enterprises in Fukuoka City, Fukuoka Prefecture, where you can learn the 'first steps' in DX talent development and implementation support. While introducing case studies of representative DX tools such as Power Automate and Power BI, you will experience hands-on sessions with Copilot, allowing you to grasp practical small-start methods that can be implemented on-site. The content also includes specific success stories from the Fukuoka region, along with tips for promoting understanding and advancement within your organization.

We will be exhibiting at INCHEM TOKYO 2025, which will be held at Tokyo Big Sight from September 17 (Wednesday) to September 19 (Friday). This time, we will host many events, including special project stages and mini-seminars. At our booth, we will introduce our solutions and technologies based on the theme of "Sustainable Plant Engineering" from three different concepts. Please be sure to stop by our booth, East Hall 6, K-17.

The Siemens EDA Tech Forum is a technical event aimed at sharing the latest technological trends, case studies, and solutions to challenges with everyone involved in the design and development of silicon systems and electronic systems, while addressing evolving technologies, the densification and complexity of designs, and various design challenges, all while meeting requirements for quality, safety, and reliability. The goal is to deepen insights and networks towards achieving sustainable business. The forum covers a wide range of topics, from advanced design technologies and methods in fields such as 3D ICs, chiplets, chips for AI and ML (machine learning), and IC packaging, to the design, analysis, and collaborative development of electronic systems, including printed circuit boards, across multiple domains, as well as building ecosystems both internally and externally using digital threads. Through case presentations and explanations of design methods by industry leaders, it supports solutions to challenges faced in daily design work from all directions. This is a free technical event that requires pre-registration. We hope you will participate!