8th Railway Technology Exhibition

Contributes to reducing installation costs and labor-saving in material replacement! It has a good noise reduction effect compared to vibration-damping slab tracks.

The product is a detachable vibration-damping sleeper direct connection track that is economical and environmentally friendly. Even if the sleeper pads deteriorate, they can be replaced without damaging the subgrade concrete. Height adjustments after installation can be made even under the sleepers. Additionally, it has good noise reduction effects compared to vibration-damping slab tracks. Furthermore, expanding the sleeper spacing allows for a reduction in installation costs. 【Features】 ■ For new lines ■ Cost reduction for installation ■ Labor-saving for material replacement ■ Height adjustment of the track is possible ■ Noise reduction effect *For more details, please refer to the PDF materials or feel free to contact us.

• Railway Construction

The structure is simple and has a small number of parts, making it easy to handle.

We handle fastening devices for both straight and curved tracks. Our double-elastic fastening device with a two-spring type allows for a gauge adjustment range of -7.8mm to +23.4mm (example for a 50N fastening device) depending on the combination of parts. Additionally, we also offer "general-purpose PC sleepers" compatible with multi-rail systems. Please feel free to contact us if you have any requests. 【About PC Sleepers】 ■ The same sleeper can be used for both straight and curved applications. ■ By replacing the spring clip, it can be used for 60Kg, 50N, 40N, 37Kg, and 30Kg rail types. *For more details, please download the PDF or feel free to contact us.

• others

We have options for 50N rails and 60kg rails.

We handle the "TK-style Plastic Plate Level Crossing." The material of the plastic plate is made from recycled plastic (LDPE: low-density polyethylene), so it does not corrode. Additionally, the length of the plastic plate itself is 1100mm, the width is approximately 400mm, and the weight is about 47kg. The ramp for the outer rail is approximately 20kg, and for the inner rail, it is about 40kg, allowing for manual installation. [Track Gauge] ■ For 1067mm ■ For 1372mm ■ For 1435mm *For more details, please download the PDF or feel free to contact us.

• others

In the field of food and health food research and development, an increasing number of companies are facing the following challenges: - Difficulty in exploring new functional materials and differentiation themes, leading to a depletion of research topics. - While they are collecting information from conferences and papers, they struggle to translate this into research themes directly related to their products. - They remain limited to competing similar products and follow-up projects, failing to establish uniqueness. - Although there are seeds of ideas, they struggle to elevate them to scientific hypotheses and build the necessary foundations for internal approval. Behind this lies a "wall of execution" that cannot be overcome by traditional information gathering and research processes. In this webinar, we will introduce a new R&D approach to break through these challenges. It is a next-generation research and development scheme that combines AI-driven hypothesis generation, which has achieved results in drug discovery, with scientific hypothesis verification by a food human trial CRO. This will allow for the transformation of vague ideas into scientifically verifiable projects, simultaneously achieving the construction of persuasive foundations for upper management and differentiation development.

Fujikohsuhou Industrial Co., Ltd. will hold an online seminar titled "Tips for Setting Laser Hardening Conditions" on July 20, 2025 (Wednesday). In laser hardening, factors such as output and speed are related to the quality of hardening. We will explain how output and speed are connected to quality factors. This seminar is aimed at those who are looking to start utilizing laser hardening. 【Recommended for】 ■ Those who want to learn about methods for setting laser hardening conditions ■ Those who want to obtain technical information about laser hardening

Take the 'first step' in DX talent development in Fukuoka. We will hold a free seminar where you can learn reskilling strategies that can be applied in the field through case studies and experiences! 'I've become responsible for DX, but I don't know where to start.' This is a participatory seminar aimed at representatives from small and medium-sized enterprises in Fukuoka City, Fukuoka Prefecture, where you can learn the 'first steps' in DX talent development and implementation support. While introducing case studies of representative DX tools such as Power Automate and Power BI, you will experience hands-on sessions with Copilot, allowing you to grasp practical small-start methods that can be implemented on-site. The content also includes specific success stories from the Fukuoka region, along with tips for promoting understanding and advancement within your organization.

We will be exhibiting at INCHEM TOKYO 2025, which will be held at Tokyo Big Sight from September 17 (Wednesday) to September 19 (Friday). This time, we will host many events, including special project stages and mini-seminars. At our booth, we will introduce our solutions and technologies based on the theme of "Sustainable Plant Engineering" from three different concepts. Please be sure to stop by our booth, East Hall 6, K-17.

The Siemens EDA Tech Forum is a technical event aimed at sharing the latest technological trends, case studies, and solutions to challenges with everyone involved in the design and development of silicon systems and electronic systems, while addressing evolving technologies, the densification and complexity of designs, and various design challenges, all while meeting requirements for quality, safety, and reliability. The goal is to deepen insights and networks towards achieving sustainable business. The forum covers a wide range of topics, from advanced design technologies and methods in fields such as 3D ICs, chiplets, chips for AI and ML (machine learning), and IC packaging, to the design, analysis, and collaborative development of electronic systems, including printed circuit boards, across multiple domains, as well as building ecosystems both internally and externally using digital threads. Through case presentations and explanations of design methods by industry leaders, it supports solutions to challenges faced in daily design work from all directions. This is a free technical event that requires pre-registration. We hope you will participate!