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  3. 技術情報協会
  4. [Book] Latest Trends in Next-Generation Semiconductor Packaging and the Development of Its Materials and Processes (No. 2197) [Available for Preview]
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  • Apr 27, 2023
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Apr 27, 2023

[Book] Latest Trends in Next-Generation Semiconductor Packaging and the Development of Its Materials and Processes (No. 2197) [Available for Preview]

技術情報協会 技術情報協会
- 2.XD, 3D Integration and Substrate Materials, Encapsulation and Bonding Technologies, Heat Dissipation Materials - ★ As the miniaturization of integrated circuits approaches its limits and the differentiation of advanced semiconductors becomes crucial, packaging technology holds the key! This publication covers the transformation of packaging technology associated with chiplets and 3D integration, along with new materials and process technologies. --------------------- ■ Table of Contents Chapter 1: Advanced Semiconductor Packaging Technologies and Their Structures, Process Technologies Chapter 2: Implementation Technologies and Heat Dissipation Measures for Next-Generation Power Semiconductors Chapter 3: Design of Semiconductor Encapsulation Materials, Required Characteristics, and Characteristic Improvement Technologies Chapter 4: Adhesion and Bonding Technologies in Semiconductor Packaging and Reliability Evaluation Chapter 5: Material Technologies for Printed Circuit Boards and Wiring Formation, Processing Technologies Chapter 6: Development Trends and Thermal Property Evaluation of Heat Management Materials Chapter 7: Analysis and Inspection Technologies for Semiconductor Packages --------------------- ● Publication Date: April 28, 2023 ● Format: A4, 613 pages ● Authors: 56 ● ISBN: 978-4-86104-945-4 ---------------------
"Latest Trends in Next-Generation Semiconductor Packaging and the Development of Its Materials and Processes" Book Photo
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[Book] Latest Trends in Next-Generation Semiconductor Packaging (No. 2197)

[Available for preview] ~ 2.XD, 3D integration and substrate materials, encapsulation and bonding technologies, heat dissipation materials ~

Book Title: Latest Trends in Next-Generation Semiconductor Packaging and the Development of Its Materials and Processes ★ As the miniaturization of integrated circuits approaches its limits, the differentiation of advanced semiconductors hinges on packaging technology! This book covers the transformation of packaging technology associated with chiplets and 3D integration, along with new materials and process technologies. ■ Key Points of This Book - Development status of next-generation packaging technologies such as FOWLP, 2.XD, silicon bridge, and 3D... - Hybrid bonding technology and new bonding materials that are key to 3D stacking. - Required characteristics of sealing materials for new applications and the suppression of cracks and delamination. - Build-up processes that achieve fine wiring and high density in package substrates. - Package structures that demonstrate the performance of next-generation WBG semiconductors, along with high-heat-resistant sealing and bonding materials. - Causes and countermeasures for defects such as cracks, voids, and whiskers in solder mounting. - Compatibility of low dielectric properties and other characteristics (heat resistance, low CTE, etc.) in films for multilayer substrates for high-speed communication. - Techniques for the densest packing of fillers for high thermal conductivity, and the design of heat dissipation materials that are both highly thermally conductive and low dielectric.

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[Book] Latest Trends in Next-Generation Semiconductor Packaging and the Development of Its Materials and Processes (No. 2197)

[Book] Latest Trends in Next-Generation Semiconductor Packaging and the Development of Its Materials and Processes (No. 2197)

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We have released the materials on 'Attendance issues pointed out by the Labor Standards Inspection Office, and this was the common point!'

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We have released a white paper titled "The Common Points of Attendance Issues Highlighted by the Labor Standards Inspection Office." This document provides a clear explanation of the challenges in attendance management that are likely to be pointed out by the Labor Standards Inspection Office, using specific examples. It addresses operational risks commonly seen in many companies, such as attendance aggregation in Excel, timekeeping management through self-reporting, insufficient management of paid leave, and rounding of overtime hours. Additionally, it introduces points that are often highlighted in inspections by the Labor Standards Inspection Office, such as "objective understanding of working hours," "unpaid overtime," "management of the 36 Agreement limits," and "compliance with the obligation to take 5 days of annual leave." This content can serve as an opportunity for companies that think "there have been no problems so far, so it's fine" to review their operations. Companies considering improving the efficiency of attendance management and strengthening compliance are encouraged to take a look. If you have any additional questions, please feel free to let us know.

Jul 08, 2026

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[Please introduce this to the management and general affairs department] With a checklist for evaluation! The back office system overturns the "single manufacturer option"! Are you aware of the benefits of adopting an agency?

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What do the members of the back office department consider when choosing or replacing a system? If the same product is handled by both a "manufacturer" and a "distributor," how do you feel about it? "Distributor"? Isn't it cheaper to buy directly from the manufacturer? It's obvious that receiving direct service is better, right? ...Is that really the case? In the materials we are releasing this time, we will explain the benefits of "introducing a distributor." Here’s a preview of the materials: 【If you’re going to choose, you should leverage the power of a distributor that handles the ○○ system!】 【Make the distributor your ○○○○○○○ and use them to the fullest!】 Along with these points, we are offering a "Distributor Evaluation Checklist" that will be your strong ally, free of charge! Please make good use of it.

Jul 07, 2026

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Introducing commercial aroma diffusers to cabaret clubs in Kanagawa Prefecture! The fragrance experience is by Majesta Fragrance.

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We have introduced the commercial diffuser rental service "MajestaFragrance" to cabaret club establishments in Kanagawa Prefecture. In the nightlife business, such as cabaret clubs, lounges, clubs, and bars, the ambiance created by "fragrance" significantly influences the store's impression and branding, in addition to interior design and lighting. The high-quality scent that customers experience the moment they open the door enhances the sense of luxury and cleanliness, elevating the first impression of the establishment. Creating a memorable space also contributes to increased repeat rates and customer satisfaction. For the establishments that have adopted our service, we selected a sophisticated fragrance inspired by luxury hotels. MajestaFragrance also offers free trial installations. If you are interested in fragrance design, please feel free to contact us.

Jul 06, 2026

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[Special Selection] Commercial Air Conditioners - Benefits of the Latest Commercial Air Conditioners for Store Management - | Suminomori

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When it comes to updating commercial air conditioning systems, it is often thought of as a way to "reduce electricity costs," but replacing them with the latest models brings various benefits to the operation of stores and offices as well. By improving air conditioning performance, it helps to minimize temperature variations within the store or office, creating a comfortable environment for customers and staff. Additionally, it reduces the risk of sudden breakdowns due to aging equipment, which is a significant advantage in minimizing the impact on business operations. Among these, Mitsubishi Electric's "Mr. SLIM" not only boasts energy-saving performance but also offers a diverse lineup of indoor units, allowing for flexible proposals tailored to the installation environment, whether it be a store, office, or restaurant. Commercial air conditioning is not just a facility that provides heating and cooling; it is an essential system that supports the creation of a comfortable space and the operation of stores. If you are considering an update, please feel free to consult with "Sumino Mori."

Jul 06, 2026

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DXsite NETIS registration information

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Notice of DXsite NETIS Registration Thank you very much for your continued support of our services. We are pleased to announce that our service, DX Twin View, has been registered as a new technology with NETIS. Technology Name: Digital Twin Construction Management System (DX Twin View) NETIS Registration Number: KK-260017-A We will continue to strive to be a company that meets our customers' expectations with reliable technology and new ideas. We appreciate your continued support.

Jul 06, 2026

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