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  4. [TOKYO PACK 2022 (Tokyo International Packaging Exhibition) Exhibition] Proposing cost reduction and productivity improvement achieved without blade types.
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  • Oct 13, 2022
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Oct 13, 2022

[TOKYO PACK 2022 (Tokyo International Packaging Exhibition) Exhibition] Proposing cost reduction and productivity improvement achieved without blade types.

コムネット コムネット
Comnet Co., Ltd. will be exhibiting at TOKYO PACK 2022 (Tokyo International Packaging Exhibition), which will be held at Tokyo Big Sight from October 12 (Wednesday) to October 14 (Friday), 2022. TOKYO PACK is one of the world's leading international comprehensive packaging exhibitions, covering all fields from procurement to production, logistics, distribution, sales, consumption, and disposal/recycling, focusing on packaging materials, containers, and packaging machinery. We sincerely look forward to your visit. Event Schedule: October 12 (Wednesday) to October 14 (Friday), 2022 Time: 10:00 AM to 5:00 PM (Visitor registration starts at 9:30 AM) Venue: Tokyo Big Sight (Tokyo International Exhibition Center), East Halls 1-3 and 6 Address: 3-10-1 Ariake, Koto-ku, Tokyo 135-0064 Comnet Booth Number: 2-74 Exhibited Models by Comnet: Laser processing machine for paper containers and packages SEI Series PAPER ONE *Sample display Laser processing machine for flexible packaging SEI Series PACK MASTER *Sample display Laser processing machine for seals and labels SEI Series LABEL MASTER *Live demonstration
[Exhibition Content and Highlights] Cost reduction and productivity improvement achieved without blade types.
[Exhibition Content and Highlights] Cost reduction and productivity improvement achieved without blade types.
Laser processing machine for flexible packaging SEI series PACK MASTER
Laser processing machine for flexible packaging SEI series PACK MASTER
Date and time Wednesday, Oct 12, 2022 ~ Friday, Oct 14, 2022
10:00 AM ~ 05:00 PM
(Event registration starts at 9:30)
Capital Event Schedule: October 12, 2022 (Wednesday) to October 14, 2022 (Friday) Time: 10:00 AM to 5:00 PM (Visitor registration starts at 9:30 AM) Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Halls East 1-3 and East 6 Address: 3-10-1 Ariake, Koto-ku, Tokyo 135-0064 Comnet Booth Number: 2-74
Entry fee Free
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PapaerOne-main.jpg

Crease System ORIGAMI - Laser Processing Machine PAPER ONE

The crease revolution in cardboard packaging production! A new product, the Digital Die-Cut Crease System ORIGAMI, allows anyone to easily create crease plates.

The Crease Revolution in Cardboard Package Production! Anyone can easily create crease plates! The digital die-cut crease system 'ORIGAMI' has arrived! 'PAPER ONE' is a system suitable for digital compounding and finishing of sheet materials. It allows for creasing from either the front or back according to the specifications of graphics and designs. 【Features of ORIGAMI】 ■ Anyone can easily create crease plates just by importing the package layout data. ■ It operates offline, allowing for production without stopping the die-cutting and creasing processes on the laser machine. ■ Creasing is possible with a mix of mountain and valley folds. 【Features of PAPER ONE】 ■ It can sandwich with both male and female plates to perform creasing simultaneously. ■ A wide variety of laser cutting options are available, including full cuts, perforated cuts, and half cuts. ★ Please check the demo video for a complete overview of 'ORIGAMI' and 'PAPER ONE' ★ *For product specifications, please refer to the PDF document or feel free to contact us.*

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packmaster-main.jpg

Laser processing machine for soft packaging film "PACK MASTER"

Laser processing machine for flexible packaging film PACK MASTER. Die-cutless, 1,800mm width, 400m/min. Easy integration into existing production lines.

This is a proposal for laser processing on flexible packaging films used in food packaging and medical supplies. PACK MASTER has been developed to process flexible packaging films used in food packaging and medical supplies by cutting, slicing, creating windows, punching holes, half-cutting, and perforating, enabling new product proposals for easy opening, ventilation, and air circulation. ▼ Brand appeal and differentiation from competitors In recent years, product packaging plays an important role in promoting the brand strength of a company's products and differentiating them from competitors. This is especially true in the food and medical supplies industries, where packaging is developed to meet customer needs. We solve the challenges faced by flexible packaging film processing, achieving increased productivity, cost reduction, and sales expansion. ▼ Product features ■ Roll width: up to 1800mm ■ Maximum speed: 400m/min (200m/min during CW processing) ■ Easy integration into existing production lines ▼ Please refer to the PDF document [Guidebook] to understand PACK MASTER in 3 minutes. "What are the reasons that laser processing can achieve increased productivity, cost reduction, and sales expansion in flexible packaging film processing?"

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labelmaster-main.jpg

Label Master Laser Processing Machine for Seal and Label Rolls

Overwhelming productivity of roll-to-roll! A proposal for a laser processing machine that can solve challenges from seal and label printing to post-processing with consistent digital processing.

The "LABEL MASTER" is a laser processing machine compatible with roll labels and stickers. It achieves overwhelming productivity and high-quality cuts with "die-cutless at 100m/min." It will assist in further improving the efficiency of small lot processing. The manufacturer, SEI, is recognized worldwide for its high technological capabilities, boasting sales of 300 units globally and 10 units domestically. The laser processing machine "LABEL MASTER" solves these challenges: ■ Equipped with the essential time-saving module for the digital age, "Auto Job Change." It reads printed QR codes and instantly changes processing data, enabling responsiveness to the increasing demand for small lots. ■ No need for die-related labor or costs. Laser processing does not require dies. This eliminates not only the manufacturing costs of dies but also the labor and costs associated with die sharpening, replacement, and management. ■ Capable of processing complex shapes that cannot be achieved with dies. Laser processing excels at handling intricate and fine shapes, allowing for work that was previously impossible with blades. *For more details, please refer to the catalog materials or proposal documents, or feel free to contact us.

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■Information on Exhibiting at the "Data Center EXPO"■ 【October 23, 2024 (Wednesday) - October 25, 2024 (Friday)】

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Nitto Kohki will exhibit at the "Data Center EXPO" held at Makuhari Messe Hall 1 from Wednesday, October 23 to Friday, October 25. [Booth Number: A6-23] At this exhibition, we will showcase the "Compact Zero Spill Coupler," which is specifically designed for data centers, including supercomputers. We will also present the "Blind Mate Type," a fitting exclusively for server cooling piping, as a reference exhibit.

Sep 07, 2026

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Notice of Participation in the Local Autonomy Information Technology Promotion Fair 2026

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D-Link Japan Inc. (Headquarters: Shinagawa-ku, Tokyo, Chairman and President: Kazui Chou, hereinafter referred to as D-Link) will exhibit at the "Local Government Information Promotion Fair 2026," hosted by the Local Government Information Systems Organization (J-LIS), on October 27 and 28, 2026, at Makuhari Messe (Chiba City, Chiba Prefecture). This fair is one of Japan's largest exhibitions for information systems aimed at local governments, designed to provide information on the utilization of My Number cards, the realization of digital government, and reference information for information systems through system exhibitions, lectures, and seminars. At the D-Link booth, we will showcase wired and wireless network products and solutions that support regional networks. We will introduce network management solutions suitable for public facilities and schools that require redundancy and bandwidth expansion for wired LAN infrastructure, as well as management of multiple network products.

Sep 07, 2026

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Notice of the 21st Taste Sensor Utilization Seminar

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We will hold the highly praised Taste Sensor Utilization Seminar again this year as follows. We will invite users as speakers to introduce actual case studies. <Overview of the Event> - Date and Time: October 9, 2026 (Friday) 13:05 - 16:30 - Format: Online (Zoom Webinar) - Participation Fee: Free - Capacity: 500 people - Speakers: Kanji Doi, Executive Director, Doctor of Agriculture, Marutomo Co., Ltd. Takayuki Suetoki, Deputy General Manager, Technology Development Department, Ariake Japan Co., Ltd. Tomono Yoshimitsu, Consulting Team, Consulting Division, Aji Kaori Strategy Research Institute Co., Ltd.

Sep 04, 2026

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Three Examples of Utilizing Mojitori! Announcement of Archived Distribution for the On-Site Improvement Seminar to Reduce Input Errors, Reporting Omissions, and Personalization.

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This is an announcement for the archive distribution of the kintone plugin "Mojitori" seminar, which can read text from photos and PDFs and convert it into data. 【Three Case Studies of Mojitori Usage! A Seminar on Improving Workplaces by Reducing Input Errors, Reporting Omissions, and Personalization】 ◆ Seminar Overview The kintone plugin 'Mojitori' allows for the automatic input of text data extracted from photos, images, and PDF files into various fields in kintone. In this seminar, we will introduce 'three companies' business improvement case studies' utilizing Mojitori. We will specifically explain the challenges faced in different operations, such as label verification in manufacturing, reporting from the field, and managing client information, and why they turned to Mojitori for solutions. 【Recommended for】 - Those who want to reduce paper and handwritten record-keeping and transcription tasks - Those who want to prevent input errors and reporting omissions - Those who want to facilitate information sharing on kintone We hope you find hints that can help improve your business operations. We look forward to the participation of many people.

Sep 04, 2026

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Bed sore prevention monitoring system "Tech Mat"

Exhibiting at H.C.R. 2026, the 53rd International Welfare Equipment Exhibition & Forum. October 7th to 9th.

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We have decided to exhibit at the H.C.R. 2026 53rd International Welfare Equipment Exhibition & Forum. At this booth, we will introduce our monitoring sensor "Techmat" and our fabric flexible sensor. The Techmat is equipped with 1,024 sensors that reflect the user's body pressure distribution with millimeter-level accuracy. It visualizes changes in body orientation, movement, and pressure in real time, supporting the prevention of pressure ulcers. Additionally, because the body is in close contact with the sensor, there are fewer false detections, and alerts for sitting up or getting out of bed are immediately notified, contributing to the prevention of falls among the elderly. Furthermore, monitoring can start simply by connecting to Wi-Fi without the need for construction.

Sep 04, 2026

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