ユーバー Company Profile

Uber Corporation will be exhibiting at the "9th Japan IT Week Kansai" IoT Edge Computing EXPO held at Intex Osaka. This exhibition is composed of various IT specialized exhibitions, including "Information Security," "Data Centers," "Software and Applications," and "IT, DX, and AI." "Optimal Design and Production Support for Compact Enclosures" Ultimately, product evaluation will be conducted with actual devices, but according to customer requests, we can utilize simple thermal performance simulation software (Ansys Discovery) to design and manufacture custom cases with cooling structures. At our exhibition booth, we will showcase numerous samples of custom enclosures for electronic devices related to IT technology (thermal management, sealed structures, embedded systems, and weight reduction). We look forward to your visit to our booth.

Uber Corporation exhibited at the "8th Japan IT Week Kansai" IoT Solutions Exhibition held at Intex Osaka. This exhibition consists of various IT specialty shows, including "Sensor and Sensor Network Construction," "Data Analysis and Utilization Systems," "Security," and "AI and Predictive Maintenance Solutions." "Optimal Design and Production Support for Compact Enclosures" Ultimately, product evaluation will be conducted with actual devices, but according to customer requests, we can utilize simple thermal performance simulation software (Ansys Discovery) to design and manufacture custom cases for cooling structures. At our exhibition booth, we displayed numerous samples of custom enclosures for electronic devices related to IT technology (thermal measures, sealed structures, embedded systems, and weight reduction). We sincerely thank everyone who visited us.

Uber Corporation exhibited at the "10th IoT and Edge Computing EXPO Autumn" held at Makuhari Messe. This exhibition is the largest IT and DX exhibition in Japan, consisting of 12 specialized IT exhibitions themed around the digital domain, including "Generative AI," "Utilization of DX," "Data Analysis and Utilization," "Information Security," and "Business Efficiency." Many customers from both domestic and international markets attended the event. "Optimal Small Enclosure Design and Production Support" Ultimately, product evaluation will require actual devices, but in response to customer requests, we can utilize simple thermal simulation software (Ansys Discovery) to design and manufacture custom cases with cooling structures. At the venue, we introduced various examples aimed at solving challenges such as thermal management for electronic device enclosures, dust and water resistance, weight reduction, and wireless compatibility, which received positive feedback.