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アイテス

EstablishmentJanuary 1, 1993
capital3000Ten thousand
number of employees106
addressShiga/Otsu-shi/1-60 Kuribayashi Town
phone077-599-5015
last updated：
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アイテス List of Catalogs

271～315 item / All 365 items

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Observation of diffusion layers in semiconductors using FIB-SEM.

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LCD panel quality analysis

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Observation of the diffusion layer of SiC MOSFET using LV-SEM and EBIC methods.

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Backside light emission analysis of SiC devices

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Failure analysis of electrostatic discharge damaged orange LED.

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OBIRCH analysis of SiC devices using short-wavelength lasers.

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Failure analysis of ICs

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Surface mount electronic component cross-sectional observation service

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Cross-section polishing service for implementation parts and electronic components.

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Contract Analysis: Laser Microscope (Observation & Measurement)

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[Contract Analysis] Laser Microscope (High-Precision 3D Measurement & Color Observation)

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Cross-section polishing (CP) method for cross-sectional observation service.

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Example of analysis using the EBSD method

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Crystal analysis of Cu using the EBSD method.

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EBSD analysis

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Crystal analysis by EBSD: Intermetallic compounds in solder joints.

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Crystal analysis by EBSD BGA

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[Analysis Example Using EBSD] Steel Plate

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[Example of analysis using EBSD] High melting point solder

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[Example of analysis using EBSD] Via

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[Example of analysis using EBSD] Pipe

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[Example of Analysis by EBSD] Screw

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[Analysis Example by EBSD] Chip

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Observation of temporal changes associated with reliability testing.

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Depth profile analysis of thin film layers using XPS angle-resolved method.

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Institute of Chemical Reaction Mechanisms

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Cross-sectional observation pre-treatment (sample cutting and resin embedding)

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Cutting process using a wire saw

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Slice processing using Isomet.

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Analysis of multilayer materials using micro-Raman spectroscopy

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GCMS analysis of liquid crystal components

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Analysis of crystallinity in resin materials using micro-Raman spectroscopy.

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AFM (Atomic Force Microscope)

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TOF-SIMS analysis of trace contaminants

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TOF-SIMS analysis of organic matter

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TMA (Thermomechanical Analysis)

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TG-DTA (Thermogravimetric Differential Thermal Analysis)

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DSC (Differential Scanning Calorimetry)

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DMA (Dynamic Mechanical Analysis)

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[Case Study] X-ray Fluoroscopy and CT Examination Equipment

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[Information] Liquid Crystal Materials and Their Analytical Techniques

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X-ray fluoroscopy and CT scanner: Device appearance and main specifications

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X-ray fluoroscopy and CT examination equipment: Examples of combined use of transmission observation and image processing technology.

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MLCC crack X-ray observation

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X-ray fluoroscopy and CT scanner reflow simulator

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