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アイテス

EstablishmentJanuary 1, 1993
capital3000Ten thousand
number of employees106
addressShiga/Otsu-shi/1-60 Kuribayashi Town
phone077-599-5015
last updated：
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アイテス List of Catalogs

226～270 item / All 361 items

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Tabletop SEM (Scanning Electron Microscope) 'TM3030Plus'

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[Data] Cross-sectional observation of solar cell modules

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[Data] Processing Damage by Mechanical Grinding Method

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HAST test of power devices

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Structural analysis of prismatic Li-ion batteries.

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Whisker observation

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Sample preparation techniques for foreign object analysis

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Sectioning using a microtome

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[Observation Case] X-ray Observation of a Toggle Switch

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Appearance observation using a digital microscope.

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Analysis of Organic Multilayer Films Using Imaging FT-IR Multilayer Films

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Analysis of Organic Multilayer Films by Imaging FT-IR: Aluminum

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Ion chromatography analysis

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Observation of fracture surfaces by SEM: crab claw

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Analysis of Li-ion battery separators

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Liquid foreign substance sampling technique for FT-IR analysis

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Measurement of resin curing degree using FT-IR.

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【Equipment】FIB (Focused Ion Beam)

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EPMA analysis

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Detection of trace elements by EPMA.

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State analysis using EPMA

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[Analysis Example by EBSD] Crab Claw

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Observation of cross-sectional processing of CCD camera module.

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[Defective Analysis Case] X-ray Observation of AC Adapter

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8-inch IC and MEMS foundry services launched.

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[Data] Whisker Analysis using EBSD

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[Data] Analysis examples of low molecular weight organic acids using ion chromatography

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Back surface polishing of semiconductors for luminescence analysis

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LED failure analysis

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[Data] Research Institute of Chemical Reaction Mechanisms, Delamination Mechanism of Heterogeneous Material Interfaces 1

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Material evaluation using a ultra-micro hardness tester.

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Example of analysis using EBSD (ceramics)

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Analysis of inorganic compounds using micro-Raman spectroscopy.

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Analysis of metal corrosion using micro-Raman spectroscopy.

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[Data] Research Institute of Chemical Reaction Mechanisms - Case Study on the Causes of Material Discoloration

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Defective analysis of LCD panels

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EBSD analysis of flexible printed circuits (FPC)

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Power semiconductor analysis services

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Whisker evaluation

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Narrowing down defective areas using the EBAC (Absorption Current) method.

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Evaluation of membrane quality using EELS analysis method

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Observation of diffusion layers in semiconductors using FIB-SEM.

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LCD panel quality analysis

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Observation of the diffusion layer of SiC MOSFET using LV-SEM and EBIC methods.

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Backside light emission analysis of SiC devices

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