三菱マテリアル List of News Articles

Mitsubishi Materials Corporation has developed the high-performance lightning protection component (surge absorber) "DH53" series, which features fast response and high surge tolerance, to address abnormal voltage (surge) measures for electronic devices that require high safety and stable operation, such as xEVs and power supplies for rapidly developing AI servers. Until now, our company has supplied surge absorbers for surge protection in xEVs (chargers and onboard OBCs) and various power supplies, receiving high praise. Recently, due to the progression of global warming leading to more extreme weather, including an increase in thunderstorm days, the risk of electronic devices being exposed to unexpected surges has risen. As a result, there is a growing demand for surge absorbers with even higher responsiveness and surge tolerance for electronic devices that require high safety and stable operation. We have successfully developed the "DH53" series of surge absorbers, which improves the surge tolerance from the conventional 3,000A to 5,000A while maintaining a high surge lifespan and fast response. This will contribute to enhancing the design flexibility and stable operation of electronic devices such as charging equipment for xEVs and power supplies for AI servers, which are increasingly demanding higher performance.

Mitsubishi Materials Corporation has developed one of the world's largest square-shaped silicon substrates, the "Square Silicon Substrate," which achieves high flatness and low surface roughness. Next-generation semiconductor packages utilizing chiplet technology, which has been gaining attention in recent years, are being scaled up to approximately 100mm square. In the manufacturing process of semiconductor packages, using conventional φ300mm silicon wafers as carrier substrates for placing semiconductor chips in Wafer-Level Packages (WLP) presents a challenge, as the small area and circular shape of the wafers make it difficult to efficiently fit packages onto the wafer substrate. To address this challenge, our company has developed a large-area square-shaped "Square Silicon Substrate" by combining the casting technology for large silicon ingots that our group has cultivated over the years with our unique processing technology. The "Square Silicon Substrate" contributes to improving productivity in the semiconductor field by being utilized as a carrier substrate in semiconductor manufacturing processes and as an interposer material for semiconductor packages.