石井工作研究所 Company Profile

Pursuing forward-looking technologies that lead the times. We will continuously create new value.

Our company primarily engages in the development, design, manufacturing, and sales of precision molds and equipment, focusing on semiconductor manufacturing. The semiconductor manufacturing process can be broadly divided into the front-end process, which involves processing semiconductor wafers, and the back-end process, which includes connecting and encapsulating individual separated semiconductors to lead frames, cutting and molding from the semiconductor lead frames, marking on the semiconductors, and product inspection. Currently, one of our flagship products is the lead processing machine that cuts and molds the leads (legs) of semiconductors. This lead processing machine is equipped with the world's first extremely compact press machine, "Soft Press," which achieves low noise below the noise exposure standards for presses and energy savings, significantly improving the work efficiency and working environment of the semiconductor manufacturing process, and has received high praise.