東芝ナノアナリシス List of Products and Services

This document provides a detailed explanation of the "Contract Analysis Service Reliability Evaluation" conducted by Toshiba Nanoanalysis Corporation. It richly introduces various tests, such as temperature cycle tests for electronic components to confirm resistance against thermal stress caused by temperature changes, and X-ray irradiation tests to evaluate the effects and resistance of materials. Please feel free to consult us when you need our services. 【Contents】 ■ Reliability Testing ■ Temperature Cycle Testing for Electronic Components ■ Observation of Aging Degradation through Temperature Cycle Testing ■ Observation of Aging Degradation through Thermal Shock Testing ■ X-ray Irradiation Testing ■ Solder Heat Resistance Testing for Surface Mount Components ■ Bond Strength Testing for Semiconductor Packages *For more details, please refer to the PDF document or feel free to contact us.

• Other measuring instruments
• Other analytical equipment
• Non-destructive testing

This document provides a detailed explanation of the "Contract Analysis Service Non-destructive Observation" conducted by Toshiba Nanoanalysis Corporation. It includes numerous examples such as observing current paths within printed circuit board wiring patterns using a magnetic field microscope, and examining the adhesion of wafer bonding using an ultrasonic microscope (reflection method). Please feel free to consult us when needed. [Contents] ■ Magnetic Field Microscope ■ Ultrasonic Microscope (SAM) ■ 3D X-ray Microscope (X-ray CT) ■ Flow of Contract Analysis Services *For more details, please refer to the PDF document or feel free to contact us.

• Non-destructive testing
• Other analytical equipment
• Other measuring instruments

‘You can see it without breaking it!’ is a contract analysis service that reveals hidden abnormalities. Non-destructive observation methods include magnetic field microscopy that visualizes current paths, ultrasonic microscopy that detects delamination with high sensitivity, and X-ray microscopy (X-ray CT) that allows for three-dimensional observation of internal structures. By combining these methods, it is possible to capture various phenomena. Additionally, high-brightness X-rays enable real-time observation of the water absorption and disintegration initiation of tablets, and video provision is also possible. Please feel free to contact us. 【Features】 ■ Visible delamination and cracks ■ Visible three-dimensional structures ■ Visible magnetic fields and currents ■ Visible numerical values of interest (particle size, volume, orientation, voids, density) ■ Real-time observation of shape changes *For more details, please download the PDF or feel free to contact us.

• Analysis and prediction system

The magnetic field microscope is a non-destructive analysis technique that measures the magnetic field distribution generated by electric currents from outside the measurement target and estimates the current paths flowing within the measurement target. By observing abnormal areas such as shorts identified by the magnetic field microscope with a 3D X-ray microscope (X-ray CT), detailed cause analysis can be performed non-destructively. Please feel free to contact us when you need our services. 【Analysis Flow】 1. Abnormal detection using the magnetic field microscope 2. Observation using the 3D X-ray microscope *For more details, please refer to the PDF document or feel free to contact us.

• Other services and technologies

The "MEMS" structure, which has a three-dimensional and movable component, is hollow and sealed. To observe this structure as it is, it is necessary to conduct observations without any processing such as opening it. The 3D X-ray microscope (X-ray CT) allows for non-destructive three-dimensional observation and is effective for quality analysis, defect analysis, and reverse engineering. 【Features of the 3D X-ray Microscope】 ■ Enables non-destructive three-dimensional observation of the internal structure of the object ■ Allows for high-resolution and high-contrast observation by magnifying the X-rays that have passed through the sample with optical lenses *For more details, please refer to the PDF document or feel free to contact us.

• Non-destructive testing

In order to promote the spread of power semiconductors, the development of low-defect SiC wafers is underway. X-ray CT is a non-destructive method that visualizes the shape of materials in three dimensions and allows for quantitative evaluation. In the PDF document, you can view the CT images obtained when observing the etch pits formed on SiC wafers using a 3D X-ray microscope (X-ray CT). [Overview] ■ Shape analysis of etch pits using X-ray CT *For more details, please refer to the PDF document or feel free to contact us.

• Non-destructive testing

There may be cases where electrical products fail due to disconnection. If the wiring is covered with opaque resin or similar materials, it is difficult to locate the disconnection through visual inspection alone. In such cases, it is possible to identify the disconnection point through X-ray transmission observation. Please feel free to contact us when you need assistance. 【Overview】 ■Identification of disconnection points using X-ray transmission observation *For more details, please refer to the PDF document or feel free to contact us.

• Non-destructive testing

Our testing laboratory provides reliability evaluation services through a controlled environment and established procedures. In addition to standard specifications, we can also accommodate evaluation conditions based on your requested specifications. We support semiconductors, electronic panels, electronic components, mounted circuit boards, glass, and various materials. 【Environmental Testing and Mechanical Strength Testing (Partial)】 ■ High-Temperature Testing ■ Low-Temperature Testing ■ High-Temperature and High-Humidity Testing ■ HAST Testing / Autoclave Testing ■ Temperature Cycle Testing / Thermal Shock Testing / Heat Cycle Testing *For more details, please refer to the PDF document or feel free to contact us.

• Other services and technologies