豊和産業 List of Products and Services

It is a groundbreaking technology that projects images into the air and allows for interaction. We have adopted the principle of a two-sided orthogonal reflector. We would like to propose the development of units tailored to your needs, so please feel free to consult with us.

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MEMS, centered around photofabrication and micromachine technology, is expected to thrive in various application fields. We are pleased to present a comprehensive collection of 'Technical Data' that includes numerous processing and application technologies. This collection is filled with information on essential technologies such as 'photo-etching,' which is a key technology in MEMS and display device substrates; 'dicing processing,' a technique for accurately cutting out circuits formed on Si wafers into chips; and 'bump formation,' which is indispensable for various mounting technologies such as CSP, BGA, and flip-chip. For more details, please contact us or refer to the catalog.

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FPC (Flexible Printed Circuit) boards are circuit boards with copper electrodes patterned on a polyimide film as the base material. Since the base substrate does not use organic materials such as adhesives, it can be used in high-temperature environments. Additionally, Howa Sangyo Co., Ltd. has achieved fine pattern processing that was not possible with conventional FPC boards using methods such as etching and additive processes. Fine patterning of less than 50μm is possible. Depending on the specifications, connection bumps can be formed on the pattern or the back side. Furthermore, by combining laser processing and plating technology, through-hole conduction processing on both sides is possible. For more details, please contact us or refer to the catalog.

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Bumps are essential for various mounting technologies such as CSP, BGA, and flip chips. At Howa Sangyo Co., Ltd., we can accommodate various bump processing from just one piece, tailored to your specifications and budget. For the stud method (chip compatible only), we offer Au stud bumps in two wire diameters of 18μm and 25μm (you can choose based on bump height and diameter), and we can also handle 2-layer and 3-layer bump processing. In the plating method, we support electroplating with Au, Ni, Cu, Ag, Pt, as well as solder (eutectic and high melting point) and lead-free solder (Sn-Ag, Au-Sn), along with various electroless plating options. Furthermore, we can accommodate substrates made of glass, Si (silicon), and film. For more details, please contact us or refer to our catalog.

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At Toyowa Sangyo Co., Ltd., we create TEG chips for implementation evaluation using technologies such as film formation, photo-etching, and plating. We offer options for standard and custom products tailored to our customers' budgets and specifications. We can also accommodate small quantities. Please feel free to consult with us. Additionally, we provide back grinding processing for wafers and can also handle processing for evaluation implementation boards. For more details, please contact us or refer to our catalog.

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In 3D microfabrication for MEMS, fine machining can be performed by spraying ultra-fine particles such as alumina. Fine patterns are formed on glass substrates or silicon substrates using dedicated dry film resist, and groove formation and hole processing are carried out using sandblasting. Measurement and evaluation with a 3D measuring machine are also possible. We can accommodate prototypes starting from a single piece. High aspect ratio patterning has been achieved. Processing of grooves and holes in the micron and nanometer range is possible, and depth control can also be accommodated. We also offer chemical treatment of blasted surfaces and conductive treatment for through-holes. For more details, please contact us or refer to our catalog.

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To accurately cut and chip the circuits formed on Si wafers, a technique called dicing is used. The mainstream method involves using a dicing machine equipped with a rotating blade. At Toyowa Industry Co., Ltd., we handle processing not only for Si wafers but also for glass, ceramics, single crystal materials, resins, and more. The cutting water can be compatible with pure water. We accommodate everything from prototype processing to mass production. Additionally, we can provide cutting methods tailored to your applications (such as scribing). For more details, please contact us or refer to our catalog.

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As elements of grinding processing technology, there are "surface accuracy," "transmitted wavefront accuracy," "surface roughness," "angle accuracy," and "spectral characteristics." Particularly for optical components that require high plane and angle accuracy, Hohwa Industries Co., Ltd. provides a consistent production process from material procurement to completion based on high-precision processing technology and know-how, ensuring quality control and quality assurance in our products. For more details, please contact us or refer to our catalog.

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Thin film formation technology can be categorized into physical vapor deposition (PVD), chemical vapor deposition (CVD), and liquid phase methods. The thin film formation technologies available at Hohwa Industries Co., Ltd. include resistance heating, electron beam (EB) evaporation, sputtering, and ion plating for vapor growth methods applied to base materials such as glass, silicon wafers, ceramics, and films. In liquid phase growth methods, we can accommodate processing using electroplating, electroless plating, and sol-gel methods. These technologies are applied in the production of optical and electronic components, and we also provide film selection and design tailored to the intended use and methods. For more details, please contact us or refer to our catalog.

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Now, as one of the microfabrication technologies, processing using laser beams has become common, and the related equipment has made remarkable progress. Until now, Hohwa Industrial Co., Ltd. has supplied optical products as components for such equipment. In particular, laser masks with patterned processing on reflective mirrors are widely used for applications such as marking on packages and fine hole drilling. Since these products utilize photofabrication, they are characterized by their ability to form fine patterns. For more details, please contact us or refer to our catalog.

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We manufacture inorganic interference filters primarily for liquid crystal display elements in any pattern to meet our customers' needs. Inorganic membrane color filters can be produced using methods such as vacuum deposition, allowing for the formation of light-shielding membrane patterns as well as RGB pattern formation using dielectric multilayers that utilize light interference. They can be applied to liquid crystal displays (LCDs), organic LEDs (OLEDs), color sensors, and more. Additionally, inorganic color filters are particularly excellent in weather resistance, and their spectral characteristics can be customized through multilayer design. We offer substrate polishing, mask production, color pattern formation using photolithography, and simulations based on membrane design according to your requirements. For more details, please contact us or refer to our catalog.

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We have achieved direct electroless plating without the need for a base film such as vapor deposition or sputtering on film substrates, resulting in high adhesion, reduced lead times, and cost savings. Additionally, upon request, it is also possible to form patterns through etching after plating. Hohwa Industries is prepared to assist in research and development for industries with such applications, ready to accommodate even single prototype requests, so please consult us for prototype development. For more details, please contact us or refer to our catalog.

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We accept small-scale prototypes using photolithography and precision phototechnology, which are essential technologies in MEMS and display devices. We form thin films on substrates such as glass substrates, silicon wafers, films, and ceramics, and create fine patterns through a consistent photolithography process. We can accommodate prototypes starting from a single piece. We also support prototypes for dicing, bump formation, and more. Additionally, patterning of dielectric films and multilayer films is possible through lift-off processing. Substrate sizes can be customized. Etching of silicon wafers and glass substrates is also available. We can respond with short lead times (consultation required), and we support both rigid and flexible printed circuit (FPC) substrates. For more details, please contact us or refer to our catalog.

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Toyowa Sangyo Co., Ltd. has cherished the fundamental principle of "From Imagination to Creation," which is also our corporate motto, since our founding. We have always aimed to stay one step ahead in collaboration with the electronic and optical industries, playing our part in this endeavor. Given this environment, we believe that communication skills and simulation capabilities are particularly important. We see it as our mission to accurately assess what our customers are "currently seeking" and to utilize our proud human and technical networks to provide prompt responses. There is no doubt that in the future, not only in the electronic and optical industries but also in MEMS, telecommunications, biotechnology, and medical fields, the fusion of technologies across different industries will become increasingly active. We are committed to daily self-improvement to become a company worthy of our customers' trust, safety, and satisfaction. For more details, please contact us or refer to our catalog.

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