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FKDファクトリ

addressTokyo/Tachikawa-shi/2-42-23-1411 Akebonocho
phone080-3462-7490
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last updated:Sep 11, 2023
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<Contracted Services for Microfabrication> Dry Etching Processing

Supports your device development from R&D devices to prototyping and small-scale production!

We offer "dry etching processing" as a contract service for microfabrication. We accommodate substrate sizes from small pieces up to 300mm. We support your device development from R&D devices to prototyping and small-scale production. Engineers well-versed in dry etching respond to a variety of requests based on our unique database. 【Features】 - Supports large substrates up to 300mm - Round substrates can be accommodated up to 12 inches in diameter - Policies are determined based on careful hearings conducted by experienced process engineers *For more details, please refer to the PDF document or feel free to contact us.

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<Contracted Services for Microfabrication> Electron Beam (EB) Lithography Processing

No need for a photomask! It is possible to form ultra-fine patterns below 100nm.

We offer "Electron Beam (EB) Lithography" as a contract service for microfabrication. As the name suggests, EB lithography is a maskless exposure technology that directly draws device patterns without using a photomask. Engineers who are well-versed in EB lithography will carefully listen to your needs and propose solutions that include the preceding and following processes as necessary. 【Features】 ■ No photomask required ■ Easy modification of device patterns ■ Capable of forming ultra-fine patterns below 100nm *For more details, please refer to the PDF document or feel free to contact us.

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Multi-source simultaneous magnetron sputtering device "FRS-HG Series"

Easy discharge operation! Compact design featuring automatic matching for RF power supply.

The "FRS-HG Series" is a multi-source simultaneous magnetron sputtering device equipped with simultaneous sputtering functionality for 2 sources or 3 sources, designed for research and development. Despite being a fixed type, it features a compact and stylish design. There are three film source introduction ports available, allowing for the installation of film sources that can synergize with sputtering, such as sputtering cathodes and arc plasma deposition sources. 【Features】 - Compact and stylish design despite being a fixed type - Auto-matching is employed for the RF power supply, making discharge operation easy - Simultaneous film deposition from 2 or 3 sources allows for fine-tuning of thin film functions and performance *For more details, please refer to the PDF materials or feel free to contact us.

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Tabletop Magnetron Sputtering Device "FDS/FRS Series"

Reduce initial implementation costs and enable high performance through expansion! Upgrade according to the research stage.

The "FDS/FRS Series" is a tabletop magnetron sputtering device for research and development, equipped with the necessary functions. The basic specifications consist of a DC sputter/single cathode/rotary pump for metal thin film sputtering. With expansion options such as RF conversion, additional cathodes, and turbo molecular pump specifications, it can be upgraded to match the research stage. 【Features】 ■ Keeps initial introduction costs low while allowing for high performance upgrades later ■ Comes with an MFC for argon in the basic specifications, enabling precise control of gas flow ■ Adopts a deposition-up method to prevent dust from adhering to the sample during film formation ■ Utilizes a high vacuum-sealing SUS chamber despite being a tabletop type *For more details, please refer to the PDF materials or feel free to contact us.

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