エボニック ジャパン List of Products and Services

"VESTOPLAST eCO" is an amorphous polyolefin resin that can reduce CO2 emissions by allocating renewable carbon through a mass balance approach certified for products made from renewable raw materials. The sustainable ratio is 90-97%, and it can contribute to environmentally friendly applications such as weight reduction and improved thermal efficiency, depending on the usage. Additionally, environmental impact reduction is expected even with hand printing. 【Hot Melt Adhesives】 ■ Adhesives for automotive interiors: solvent-free, improved recyclability with polyolefin materials, transitioning from screws for part fixation to adhesives (weight reduction) ■ Laminated glass sheets: CO2 reduction through insulation effects *For more details, please refer to the related links or feel free to contact us.

• Wood deck (synthetic wood/resin)

Evonik conducts sustainability analyses based on the Portfolio Sustainability Assessment (PSA) of the WBCSD, a CEO organization of global companies aiming for sustainable development, to evaluate the overall contribution of its products and solutions to sustainability. This document features key products such as liquid polybutadiene "POLYVEST eCO" and a highly compatible bio-based high-concentration defoamer "TEGO Foamex 8820." Our company contributes to reducing the footprint and enhancing the handprint through Next Generation Solutions in four focus areas: "fighting climate change, promoting resource circulation, protecting ecosystems, and ensuring health and safety." [Contents] ■ Contribution to sustainability through Next Generation Solutions ■ Four focus areas for sustainability ■ Introduction of key products *For more details, please refer to the PDF document or feel free to contact us.

• Other biomass
• glue

5G technology, which corresponds to frequency bands exceeding 10GHz, is realized based on high-speed data transmission, requiring most of its electronic components to meet the requirements for high-frequency and high-speed signal transmission. To fully leverage the advantages of 5G, materials with low dielectric constant and low dielectric loss tangent are essential to suppress transmission speed degradation. As a global leader in specialty chemicals, we provide comprehensive solutions to accelerate the development of 5G materials. [Effects] - Resin improvement - Thermal resistance - Dielectric performance - Antenna enhancement - Coating property improvement, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Our company offers a variety of components suitable for copper-clad laminates (CCL) and flexible copper-clad laminates (FCCL) that enhance the 5G compatibility of printed circuit boards (PCBs). This document features numerous products, including "POLYVEST," which is effective in improving resin, and "COMPIMIDE Bismaleimide," which is effective in thermal resistance. The rapidly advancing 5G technology worldwide enhances satisfaction in society and the economy and can be applied in various forms. We encourage you to read on. 【Featured Products (Partial)】 <Effect: Thermal Resistance> ■COMPIMIDE Bismaleimide ■IDISIL Colloidal Silica Particles <Effect: Dielectric Performance> ■AEROSIL Fumed Silica <Effect: Antenna Reinforcement> ■ROHACELL *For more details, please refer to the PDF document or feel free to contact us.

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"ROHACELL" is a core material for sandwich structures designed for 5G applications, featuring a unique high-performance PMI foam with low dielectric constant and excellent transmission performance at high frequencies. It is designed to meet the evolving needs of communication technology, and its extremely high dielectric performance makes it ideal for advanced antennas, 5G materials, or dielectric spacers. With its ultra-fine bubble structure, it can be accurately molded even into delicate structures. [Features] - Unique high-performance PMI foam with low dielectric constant and excellent transmission performance at high frequencies - Designed to meet the evolving needs of communication technology - Ideal for advanced antennas, 5G materials, or dielectric spacers - Ultra-fine bubble structure allows for accurate molding of delicate structures - Combines RF transparency in the atmosphere, heat resistance up to 190°C, and excellent mechanical properties *For more details, please refer to the PDF document or feel free to contact us.

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Evonik, as one of the specialty chemical companies, provides a comprehensive solution to accelerate the development of 5G materials. We offer a wide range of materials that are effective in thermal resistance, including "IDISIL," which makes it easier to adjust the CTE of substrates, and "COMPIMIDE," which improves the thermal resistance of substrates. Please feel free to contact us when you need assistance. 【Features】 <COMPIMIDE Bismaleimide> ■ Easy to process (various methods) ■ Maintains mechanical properties even at high temperatures ■ High solvent resistance ■ Excellent performance under high temperature and humidity conditions *For more details, please refer to the PDF document or feel free to contact us.

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"AEROSIL" fumed silica is a high-performance resin filler that achieves low dielectric constant (Dk) and low dielectric loss tangent (Df). By imparting functionality through surface treatment, it enables control over moisture absorption, electrical properties, and rheological properties when used in PCBs (printed circuit boards) and CCLs (copper-clad laminates) for 5G applications. If you are interested in technical data regarding electrical properties, please feel free to contact us individually. 【Features】 ■ Achieves low dielectric constant (Dk) and low dielectric loss tangent (Df) ■ High-performance resin filler ■ Imparts functionality through surface treatment ■ Enables control over moisture absorption, electrical properties, and rheological properties when used in PCBs (printed circuit boards) and CCLs (copper-clad laminates) for 5G applications *For more details, please refer to the PDF materials or feel free to contact us.

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Evonik, as a specialty chemicals company, provides a comprehensive solution to accelerate the development of 5G materials. We offer a wide range of materials that are effective for resin improvement, including "Coating additives" for process enhancement, "VISIOMER" to promote polymer modification, and "POLYVEST" to enhance resin performance. Please feel free to contact us for inquiries. 【Partial Lineup】 ■POLYVEST ■Dynasylan Silane ■Siridion ■Coating additive "TEGO/NANOCRYL" ■Special methacrylate "VISIOMER" *For more details, please refer to the PDF document or feel free to contact us.

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