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ZeniMax Japan's high heat-resistant polyimide film has the highest level of dimensional stability and high heat resistance among polymer films, making it suitable for applications such as alternatives to glass, silicon wafers, ceramics, and metals, as well as for composites. Leveraging features such as "thin, flexible, lightweight, unbreakable, and easy to process," it can be applied to thin film transistor substrates that are becoming lighter, thinner, and larger, as well as to semiconductor package substrates that are becoming more densely packed. 【Features】 ■ Excellent dimensional stability: Comparable to glass and silicon wafers, with a linear expansion coefficient of 0-3 ppm/K ■ High heat resistance: Maintains flatness at 450°C (no warping or deformation) ■ Excellent surface smoothness: Comparable to display glass substrates, with a surface roughness of Ra ≈ 0.5 nm *For detailed specifications, please download the PDF. Feel free to contact us for more information.

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"Zenomax (R)" is a material that offers the highest level of dimensional stability and high heat resistance with polymer film, making it suitable for applications such as alternatives to glass, silicon wafers, ceramics, and metals, as well as for composite materials. This document introduces the high heat-resistant polyimide film "Zenomax (R)." It includes features, basic physical properties, and applications of "Zenomax (R)." We encourage you to read it. [Contents] ■ Overview of Zenomax Japan Co., Ltd. ■ Features of Zenomax (R) ■ Basic physical properties of Zenomax (R) ■ Applications of Zenomax (R) *For more details, please refer to the PDF document or feel free to contact us.

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"Zenomax®" is a high-temperature resistant polyimide film manufactured by Zenomax Japan Co., Ltd., a joint venture between Toyobo Co., Ltd. and Nagase & Co., Ltd. It possesses the highest level of dimensional stability and high heat resistance among polymer films, making it suitable for applications such as alternatives to glass, silicon wafers, ceramics, and metals, as well as for composite materials. Leveraging its features of being "thin, flexible, lightweight, unbreakable, and easy to process," it can be applied to thin-film transistor substrates that are becoming lighter, thinner, and larger, as well as to semiconductor package substrates that are becoming more densely packed. [Features] ■ Excellent dimensional stability: Comparable to glass, silicon wafers, and ceramics (linear expansion coefficient 0-3 ppm/K) ■ High heat resistance: Maintains flatness at 500°C (no warping or deformation) ■ Excellent surface smoothness: Comparable to display glass substrates (Ra ≈ 0.5 nm)

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