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  3. 大船企業日本
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大船企業日本

EstablishmentDecember 2000
capital10000Ten thousand
number of employees32
addressTokyo/Machida-shi/5-1-30 Namimachida
phone042-706-2340
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last updated:Feb 18, 2025
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大船企業日本 List of Products and Services

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Laser Processing Machine Multi-Purpose Single-Axis Laser Processing Machine [New Product]

Multi-purpose single-axis laser processing machine for new products! We provide support from the development of processing technology for new materials to the sale of production machines (custom orders available).

The multi-purpose single-axis laser processing machine was first showcased as a real machine at 'JPCA 2022' by the Japanese company Ofuna. Customers can customize the laser oscillator and table specifications according to their processing applications and materials, making it a made-to-order product. We own various types of 'multi-purpose single-axis laser processing machines,' including UV (nanosecond, picosecond) and CO2 lasers, allowing us to provide consistent support from the development of processing technologies for new materials to the sale of production machines. ■ Examples of processing with UV lasers: Processing of micro-diameter holes in ABF materials (package substrates), processing of micro-diameter holes in PI materials (flexible substrates), small-diameter hole processing in SI wafers and ceramics, cutting of Cu/PP multilayer boards, cutting of Cu/LCP double-sided boards, etc. ■ Examples of processing with CO2 lasers: TH processing of Cu2um double-sided boards, BH processing of Cu2um multilayer boards, and new materials compatible with high frequency and 5G, such as fluororesins, liquid crystal polymers, and PPE resins. *For more details, please refer to the PDF materials or feel free to contact us. *We also have various examples of processing applications, so please check the PDF materials.

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Individual Axis Drive Hole Drilling Machine "ECO-DM Series"

High-precision back drilling is possible! Achieving stable high-speed drilling through reduced weight of moving parts.

The "ECO-DM Series" is a drilling machine with individually driven axes that enables high-precision hole drilling for patterns after plating. With the DFSi detection mechanism, it achieves hole drilling for BH processing and BD processing by detecting internal layers of the substrate. Additionally, high-speed hole drilling is possible with the X, Y, Z linear motors and Z-axis air housing guide. 【Features】 ■ Automatic alignment correction for each axis (when equipped with a CCD camera) - Enables high-precision hole drilling for patterns after plating - Allows for high-precision back drilling ■ High-speed and high-precision hole drilling is possible with X, Y, Z linear motors and Z-axis air housing guide *For more details, please refer to the PDF document or feel free to contact us.

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Individual Axis Drive Profile Machining Machine 'ECO-RM Series'

Suppressing substrate warping, high-precision notching processing is also possible! Automatic correction for each axis independently during processing.

The "ECO-RM Series" is a contour processing machine with individually driven axes that can perform high-precision contour machining for patterns. With axis alignment correction, it automatically compensates for the expansion and rotation of the substrate on a per-axis basis (when equipped with a CCD camera). The machine itself drills reference holes and sets internal pins for securing the substrate, allowing for high-precision alignment processing for each piece when used in conjunction with the axis alignment correction function. 【Features】 ■ Axis Alignment Correction - Automatically compensates for the expansion and rotation of the substrate on a per-axis basis - Enables high-precision contour machining for patterns ■ Automatic Pin Insertion Function (Optional) - The machine itself drills reference holes and sets internal pins for securing the substrate - Allows for high-precision alignment processing for each piece *For more details, please refer to the PDF document or feel free to contact us.

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[Contract Processing] CO2/UV Laser, Drilling, Router *Processing Examples

We also support processing of 5G and IoT-related materials! We can provide technical proposals based on your requests, such as processing with laser composites or performing high-precision back drilling.

Our company specializes in contract processing of printed circuit boards used in 5G, IoT, automotive, HDI, Mini-LED, and base stations. We possess UV/CO2 laser processing machines capable of ultra-small diameter processing, as well as drilling machines and router machines. By combining these, we can propose processing technologies for printed circuit boards tailored to your needs. We also accept technical consultations and development regarding processing methods, and we handle various inspection devices (such as Hall AOI and circuit AOI). 【Examples of Processing Materials】 PTFE-based, FR-5-based, PPE/PPO-based, R-5515, R-1566, MEG6, MEG7, MEG8, RO4350B, RO3003G2, etc. 【If you have the following requests, please feel free to consult with us】 - I want to process using CO2/UV or other lasers (processing with CO2/UV or PICO/femtosecond lasers, etc.) - I want to process new materials or difficult-to-process materials (ABF materials, Rogers materials, MEGTRON materials, glass materials, etc.) ★ We are also conducting test processing! If you are interested, please apply through the inquiry form. *We are currently offering materials that introduce examples of processing cases.

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