デンカ List of Products and Services

The "Denka AN Plate" is a high thermal conductivity ceramic substrate made from aluminum nitride, which has a thermal conductivity approximately seven times that of alumina. It is mainly used as a ceramic circuit board for power modules that require high thermal conductivity and high voltage resistance characteristics. In addition to the standard type (150W/mK), we offer various grades including a high thermal conductivity type (180W/mK), a high reliability type with excellent heat cycle resistance, and a thick plate type for even higher voltage resistance. 【Features】 ■ High thermal conductivity: About seven times that of alumina ■ High insulation: Low dielectric constant with excellent electrical properties comparable to alumina ■ Mechanical properties: High strength equivalent to alumina ■ Low thermal expansion rate: Thermal expansion rate close to that of silicon *For more details, please download the PDF or feel free to contact us.

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We offer a variety of products as molded bodies of "Denka Boron Nitride," including BN single-component types (N-1, NB-1000), single-component + additive blends (HC), and composite types, to meet diverse customer needs. The single-component types excel in heat resistance and insulation resistance, while the SBN and BA types are suitable for structural materials, glass fixture materials, and semiconductor manufacturing equipment parts due to their hardness and bending strength. 【Molding Processing Methods】 ■ Single-component and HC type molded bodies - Can be processed using methods equivalent to those for graphite, including cutting, grinding, and hole processing - Use soft steel processing tools or carbide tools on soft processing machines - Avoid the use of cutting oils ■ Composite types such as SBN - The use of carbide or diamond tools is appropriate *For more details, please download the PDF or feel free to contact us.

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"Denka Silicon Nitride Powder" is widely used by many customers as the de facto standard grade of directly nitrided powder. We offer a range of products that match customer needs, from coarse particles to ultra-fine particles with an average particle size in the submicron range, as well as high-purity types utilizing our long-developed nitriding technology and advanced process control technology. 【Features】 ■ Molds made from silicon nitride powder are lightweight and exhibit excellent high-temperature strength and fracture toughness, as well as outstanding properties such as wear resistance, corrosion resistance, and thermal shock resistance. ■ A material with potential for automotive engine parts, electronics components, industrial machinery parts, and various composite raw materials. *For more details, please download the PDF or feel free to contact us.

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"Hard Rock OP/UV" is an evolving ultraviolet curing adhesive developed by our company. The OP series is an optical ultraviolet curing adhesive made from our proprietary thiol resin technology, which possesses excellent optical performance and is used for bonding optical components such as lenses and prisms. Additionally, the UV series is an ultraviolet curing adhesive that uses acrylic resin, allowing for rapid curing through UV irradiation, contributing to labor-saving measures such as line shortening. For areas not exposed to UV, there are also hybrid curing options available, such as UV heating and two-component UV systems. [Features] ■ OP Series - The cured material has flexibility, minimizing distortion to the substrate. - No curing inhibition from oxygen. - Possesses optical properties close to glass. ■ UV Series - UV rapid curing, single-component, solvent-free, high heat resistance, high durability. *For more details, please download the PDF or feel free to contact us.

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"Hard Rock" is a two-component main agent type modified acrylate structural adhesive that has been pioneeringly developed with unique technology. It has a track record of over 30 years in the field since its launch, a pursuit of high performance, and a history of development focused on reliability. 【Features】 ■ Composed of acrylic resin and acrylic oligomer (rubber), it possesses strength and toughness. ■ Has excellent balance and outstanding adhesive properties (shear, impact, peel). ■ Excellent workability (room temperature fast curing type, compatible with rough two-component mixing ratios, adhesion on oily surfaces, etc.). ■ Available in low odor types, as well as heat dissipation and flame retardant types. *For more details, please download the PDF or feel free to contact us.

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The "ELEG Grip Tape (Dicing Tape)" is used to secure workpieces during the dicing process in the manufacturing of semiconductors, electronic components, and optical components. As chip diversification and quality improvement increase, this tape requires advanced technology. Additionally, it is used in a wide range of applications for various workpieces, including semiconductors (compound semiconductors) such as silicon and gallium arsenide, encapsulation package substrates, ceramics, glass, and quartz. 【Features】 ■ Excellent long-term stability (T series) ■ Superior adhesion (conformability) ■ Compatible with difficult-to-adhere workpieces such as EMC (epoxy mold compound) ■ Excellent expandability, making pickup easy *For more details, please download the PDF or feel free to contact us.

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"Denkasa Thermofilm ALS" is a cover tape film for heat seal type embossed carrier tape that has excellent sealing properties. It has good release characteristics against various bottom tape materials such as PS (polystyrene), PC (polycarbonate), PET (polyester), and PVC (polyvinyl chloride). 【Features】 ■ Various grades available, including antistatic treated products ■ The ATA grade is highly transparent, providing excellent visibility of the contents, and has low friction charging with epoxy-sealed components, making it effective for static electricity prevention measures for components. *For more details, please download the PDF or feel free to contact us.

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The "Denka Hit Plate" is a high thermal conductivity metal base substrate formed from an epoxy-based insulating layer filled with a highly thermally conductive inorganic filler on an aluminum base, achieving thermal resistance equivalent to or lower than that of alumina ceramic substrates. It is used in a wide range of fields, including air conditioner inverters, automotive components, motorcycle electrical parts, and power supplies for communication equipment, and has received high praise from the market. [Features] ■ High thermal conductivity (up to 10W/mK available) ■ High reliability (withstand voltage, heat resistance, heat shock resistance, durability) *For more details, please download the PDF or feel free to contact us.

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The "Denkatherm Sheet EC" is a sheet made conductive by carbon black. It is available in grades based on polystyrene and polycarbonate, allowing for a wide range of applications. 【Features】 ■ Excellent balance of mechanical strength and moldability, enabling adaptation to complex shapes and deep-drawn forms. ■ With a three-layer structure, it maintains stable conductivity, making it effective for static electricity countermeasures. ■ Grades with enhanced abrasion resistance on the sheet surface are also available to prevent contamination of semiconductors and electronic components. *For more details, please download the PDF or feel free to contact us.

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"Back Grind Tape" is a tape that can protect the circuit surface during the grinding of the wafer's backside. Designed with an adhesive that does not require a cleaning process, it combines low particle generation and stable grindability. It has minimal changes in adhesive strength over time, ensuring stable release properties. 【Features】 ■ Excellent adhesion to the unevenness of the wafer circuit surface ■ Stable grindability during back grinding (low TTV) ■ Eliminates the need for a cleaning process by achieving stable low particle characteristics ■ Minimal changes in adhesive strength over time, ensuring stable release properties *For more details, please refer to the PDF document or feel free to contact us.

• Safety and consumables