シンコー List of Products and Services

In "flat grinding processing," high-precision grinding is performed using diamond grinding wheels. We can accommodate various grinding processes such as flat grinding, cylindrical grinding, and profile grinding. We can handle everything from thin grinding of 0.1mm to large work sizes of W600×D300×H250mm. Please feel free to consult us. 【Work Size and Specifications】 ■ Maximum Work Size: W600×D300×H250mm ■ Processing Accuracy: ±0.005mm ■ Work Thickness: >t0.1mm ■ Remarks - Processing can be done according to customer specifications depending on the material and work size. *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce the strengths of Shinko Co., Ltd. in cutting technology. Our company can perform total processing from cutting, grinding, polishing to grooving, allowing for centralized management of quality and delivery times. Additionally, we can handle small lot processing in quantities tailored to your needs, and we also plan and design processes for mass production. 【Our Strengths】 ■ Total processing from cutting, grinding, polishing to grooving ■ Centralized management of quality and delivery times ■ Small lot processing in quantities tailored to your needs ■ Planning and designing processes for mass production ■ Consultation available for processing of new materials under research and development ■ Smooth prototyping, verification, and improvement through consistent processing *For more details, please refer to the PDF document or feel free to contact us.

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Cutting processing is a method of cutting and shaping the target object, and by selecting the appropriate method, it can be processed with high precision. "Slicer cutting processing" involves adhering with WAX suitable for the product and processing conditions, allowing for strip cutting, individual piece cutting, deep groove processing, and wide groove cutting according to patterns and product edges. The main processing materials include alumina, aluminum nitride, piezoelectric ceramics, and glass materials. 【Work Size】 ■ Maximum: 250×160×15.0mm ■ Minimum cutting dimension: 0.5mm ■ Deep groove specification slicer: t40.0mm, capable of groove depth up to 35.0mm ■ Cutting precision: ±0.01mm～ *For more details, please refer to the PDF document or feel free to contact us.

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"Multi-wire saw cutting processing" is a cutting method that minimizes damage to the workpiece due to free abrasive cutting. With a cutting allowance of approximately 0.20mm, it achieves high material yield and excels in the fine, high-precision cutting of expensive crystal materials. We offer a wide range of models, from small machines to those capable of handling up to 8 inches, allowing us to meet diverse needs from small lots of various types to mass production. [Features] ■ Minimizes damage to the workpiece due to free abrasive cutting ■ Extremely low cutting allowance of approximately 0.20mm, resulting in high material yield ■ Excels in fine, high-precision cutting of expensive crystal materials ■ A wide range of models available, from small machines to those capable of handling up to 8 inches ■ Accommodates diverse needs from small lots of various types to mass production *For more details, please refer to the PDF document or feel free to contact us.

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Cutting processing is a method of cutting and shaping the target object, and by selecting the appropriate method, high precision processing can be achieved. "Dice cutting processing" involves mounting on dicing tape that matches the product and processing conditions, allowing for high-precision alignment cutting according to dicing cuts or patterns, as well as bevel cuts and groove processing. The main processing materials include alumina, aluminum nitride, and glass materials. 【Work Size】 ■ Maximum φ260mm × t0.5mm (High torque dicer φ300mm × t3.0mm) ■ Minimum cutting dimension: 0.2mm ■ Cutting precision: ±0.01mm *For more details, please refer to the PDF document or feel free to contact us.

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Our company performs processing using "dicing processing technology" and "burr-free processing technology." We respond to customer needs with reliable quality from small-scale prototypes to mass production. Burr removal is unnecessary—our minimal burr removal technology improves quality and productivity. In addition to high-precision machining of brittle materials and difficult-to-cut materials, we also accept development and manufacturing of magnetic heads, dressing materials, and other materials. 【Processing Fields】 ■ Components related to optical communication equipment ■ Components for optical devices ■ Automotive-related components ■ Components for medical devices ■ Components for office equipment ■ Electronic components *For more details, please refer to the PDF materials or feel free to contact us.

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We would like to introduce Shinco's processing technology, "Dicing Processing." Tape dicing achieves a reduction in scratches, dirt, and foreign material adhesion, as well as cost savings. Additionally, we can perform alignment cutting using various software, suppress and remove burrs (plating and metallization), and support high-pressure nozzles and two-fluid spin cleaning machines. We respond to customer needs with reliable quality from small-scale prototypes to mass production. 【Features】 ■ Tape Dicing: Reduction of scratches, dirt, and foreign material adhesion, cost savings ■ Square Chuck Table: Supports large substrates and reduces costs through multi-layer processing ■ Alignment cutting using various software ■ Suppression and removal of burrs (plating and metallization) ■ Capable of cutting and grooving thick materials (up to t10mm) ■ Compatible with high-pressure nozzles and two-fluid spin cleaning machines *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce our processing technology, "Burr-less Processing." This technology allows us to solve the problem of burr generation in the processing of metal materials and metallized products. Shinko responds to various needs such as new product development with our capability to handle everything from prototyping to mass production and our high-precision processing technology. 【Processing Examples】 ■ Tungsten rod cutting (Application: Electrode) Standard: MAX 0.1mm → Actual value: MAX 0.003mm ■ Resin substrate cutting (Application: Surface mount substrate) Standard: MAX 0.1mm → Actual value: MAX 0.01mm ■ Alumina substrate cutting (Application: Optical communication circuit substrate) Standard: MAX 0.03mm → Actual value: MAX 0.004mm *For more details, please refer to the PDF document or feel free to contact us.

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