輝創 Company Profile

Apply thin. Dry. Heat-press to bond. Thin-layer bonding for dissimilar materials.

KISOH Corporation develops a unique bonding technology based on a simple process: apply a thin layer, dry it, and heat-press to bond. A thin functional layer is formed on the surface of a substrate. After drying, the mating material is placed on the layer and bonded by applying heat and pressure. The technology is being developed not only for metal-to-metal bonding but also for bonding metals to dissimilar materials. We call this proprietary technology “CAM Technology.” Its development focuses on thin-layer bonding, electrical insulation, high-temperature environments, and thermal management. Applications are being explored in electronic components, power electronics, motors, and thermal management components. We also provide bonding feasibility evaluations and trial processing according to material combinations and operating environments. Visit our official website for the latest test results and application examples.