サーテック フレキ基板(FPC)ソフトウェア ハードウェア

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サーテック Company Profile
Prototyping/Flexible Circuit Board Design Expert (Flexible Circuit Board, FPC), Printed Circuit Board, Software Contract Development, Embedded Systems, chemSHERPA
Sartec is a prototype manufacturer located in Hamamatsu City, Shizuoka Prefecture, one of Japan's leading manufacturing towns, specializing in flexible printed circuits (FPC). With a focus on "design without waste, keeping the completed form in mind," we provide a comprehensive proposal from circuit board manufacturing to component mounting and evaluation testing. We are capable of flexible responses to requests such as solving issues during the research/prototype development phase and delivering small lot orders. We aim to support and propose solutions that enable our customers' product development to progress more swiftly and result in high-quality products. We contribute to ensuring that our customers' new products and services possess uniqueness and convenience that differentiate them from competitors, thereby enhancing their development capabilities. Flexible printed circuits, FPC, prototypes, rigid-flex, pattern design, high heat resistance, membrane switches, flexible printed circuits, software contract development, firmware/embedded systems, FPGA (PLD) contract development, core systems, production management systems, order management systems, software contract development, firmware/embedded systems, chemSHERPA, hardware, resin, metal cutting, MSAP, etching.

Business Activities
■ Flexible printed circuit board (FPC) pattern design, manufacturing, assembly, and sales (prototype and mass production) ■ Printed circuit board pattern design, manufacturing, assembly, and sales (prototype and mass production) ■ Benchmark analysis and reverse engineering contract services ■ Circuit investigation and component investigation (destructive and non-destructive) contract services ■ Failure analysis, reliability testing, and environmental testing contract services ■ Software design and embedded software contract development ■ Hardware development and electronic circuit contract design ■ Product planning, graphic design, and 3D CG contract design ■ Flexible circuit board standardization and startup support ■ Sales of development support tools Flexible circuit boards, FPC, flexible, rigid-flex High heat resistance, membrane switches, flexible circuit boards, FPC, printed circuit boards, software contract development, firmware/embedded, FPGA (PLD) contract development, core systems, production management systems, order management systems Flexible circuit boards, FPC, flexible, rigid-flex High heat resistance, membrane switches, flexible circuit boards, FPC, printed circuit boards, software contract development, firmware/embedded, FPGA (PLD) contract development
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Detailed information
Company name | サーテック フレキ基板(FPC)ソフトウェア ハードウェア |
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Contact address | postalcode 431-3125 Shizuoka/ Hamamatsu-shi Chuo-ku/ 5-11-21 HandayamaView on map TEL:053-522-9255 |
Key Partners | Flexible circuit boards, flex boards, FPC, flex, rigid-flex
High heat resistance, membrane switches, flexible circuit boards, flex, FPC, printed circuit boards
To development department managers and personnel considering the development and prototyping of
Software contract development, firmware/embedded, FPGA (PLD) contract development, core systems, production management systems, order management systems, flexible circuit boards, flex boards, FPC, flex, rigid-flex, hardware
High heat resistance, membrane switches, flexible circuit boards, flex, FPC, printed circuit boards
For development and prototyping, resin, metal cutting
Software contract development, firmware/embedded, FPGA (PLD) contract development, core systems, production management systems, order management systems
Flexible circuit boards, flex boards, FPC, flex, rigid-flex
High heat resistance, membrane switches, flexible circuit boards, flex, FPC, printed circuit boards
For development and prototyping, resin, metal cutting
Software contract development, firmware/embedded, FPGA (PLD) contract development, core systems, production management systems, order management systems, hardware, etching, plating, MSAP, vacuum deposition, EB deposition, sputtering, thin film deposition, photolithography. Flexible circuit board, flex board, FPC, flex, rigid-flex, high heat resistance, membrane switch, flexible circuit board, flex, FPC, printed circuit board, software contract development, firmware/embedded, FPGA (PLD) contract development, core system, hardware, resin, metal cutting etching, MSAP, deposition, sputtering, thin film formation, photolithography. |
Industry | Information and Communications |
