小橋電機 Company Profile

To achieve high-density and high-precision substrate mounting, we are implementing inline solder paste inspection (SPI) and post-reflow appearance inspection (AOI). *3D specification.

We are primarily engaged in contract manufacturing of electrical machinery and electronic devices (EMS) through domestic production. We are a contract manufacturer capable of integrated production from high-density substrate mounting to finished product assembly for various industries, including industrial equipment, information and communication devices, and amusement equipment. Additionally, our solder printing inspection machines and appearance inspection machines for the mounting process have been streamlined into a 3D inline type, achieving high quality. Furthermore, we can accommodate reflow atmospheres in a nitrogen environment.