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[Materials and Defect Analysis] X-ray Microfocus Inspection: X-ray CT Imaging

Pixel resolution is approximately 7 to 120 µm! Measuring voids in aluminum die-cast products and solder.

Our company offers "X-ray Microfocus Inspection: X-ray CT Imaging." X-rays are irradiated onto the sample, which is rotated 360 degrees on the sample stage for imaging. This non-destructive method allows for three-dimensional observation of a wide range of products, including internal structures and defects. Due to the varying penetrability of X-rays, contrast is created based on the constituent elements (density). Elements with higher density appear bright, while those with lower density appear dark. 【Features】 - Target sample size: Diameter 150 × Height 170 mm (for vertical imaging) with a weight of 5 kg - X-rays are irradiated onto the sample, which is rotated 360 degrees on the sample stage for imaging - Enables three-dimensional observation of a wide range of products, including internal structures and defects - Contrast is created based on the constituent elements (density) due to the varying penetrability of X-rays - Elements with higher density appear bright, while those with lower density appear dark *For more details, please refer to the related links or feel free to contact us.