Ultrasonic microscope observation of printed circuit boards
Delamination inside the circuit board, which is not visible during visual inspection, can also be visualized!
At AITES Co., Ltd., we conduct ultrasonic microscopic observation (transmission method) of printed circuit boards. In printed circuit boards, defects can occur due to delamination (separation) caused by factors such as storage environment, thermal and humidity stress, and manufacturing process issues, leading to the separation of layers within the board. The transmission method involves transmitting ultrasonic waves through the observation sample and converting the received ultrasonic waves into electrical signals for imaging. If there are voids such as delamination, the ultrasonic waves do not transmit, resulting in a black appearance in the image. [Features] - Effective for detecting delamination (separation) that is not visible through visual inspection due to internal defects in the board. - Ultrasonic waves are transmitted through the observation sample for imaging. - Areas with voids such as delamination appear black in the image. *For more details, please download the PDF or feel free to contact us.
- Company:アイテス
- Price:Other