Core technology: Copper metal mesh
Metal mesh is actively used in sizes larger than PC panels!
We would like to introduce our core technology for metal mesh transparent electrodes, "Copper Metal Mesh." The surface resistance is <0.1Ω/□, the electrode formation process is etching, the minimum L/S is 5/100μm, the flexibility is R5mm@100k cycles, and there are no issues with ion migration. The touch response speed depends on the capacitance value and the surface resistance of the electrode, so metal mesh is actively adopted for sizes larger than PC panels. 【Specifications】 ■ Surface resistance: <0.1Ω/□ ■ Electrode formation process: Etching ■ Minimum L/S: 5/100μm ■ Flexibility: R5mm@100k cycles ■ Ion migration issues: None *For more details, please download the PDF or feel free to contact us.
- Company：日本マイクロン電子 本社
- Price：Other
