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Halogen Free Adhesive

Halogen Free Adhesive

Compliant with the halogen-free standards IEC, IPC, and JPCA of various international organizations.

We deliver NIC BOND products that comply with halogen-free standards, which began as part of our environmental initiatives in 2007, along with data guarantees. These products are applicable in a wide range of fields, including module assembly and the adhesion of electronic components. Our NIC BOND meets Halogen Free Standards of IEC, IPC, and JPCA. We provide data on halogen. For direct inquiries to Nichimori HP, please copy and paste the following link into your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

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Adhesive for Hard Disk Drives

Adhesive for Hard Disk Drives

It demonstrates high reliability in the assembly of hard disk drives.

This is an adhesive with a long track record in hard disk drive assembly. Features: Low outgassing, low-temperature curing, oil resistance, halogen-free. NIC BOND (Product Number): NB3040 (two-component), NB3041B (one-component) Syringe, TNB-6322HF. High Quality High Performance for HDD Drive Assembly. Characteristic: Halogen Free, Low Out Gas, Low Temp Cure, Oil Resistant. For direct inquiries to Nichimoly HP, if you need to contact directly, please copy and paste this into your Google: https://www.daizo.co.jp/nichimoly/contact_form.html.

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"Waterproof and dustproof" epoxy adhesive for seals IPX Level 7

"Waterproof and dustproof" epoxy adhesive for seals IPX Level 7

This is a new type of adhesive that combines ultra-flexibility and elasticity with the reliability of epoxy resin.

This is a waterproof and dustproof adhesive made from 100% epoxy resin, demonstrating rubber-like flexibility, a 200% elongation rate, and resistance to reflow, suitable for use in extreme cold to high-temperature environments. Premium Flexibility and 200% extend epoxy for waterproof. We provide Direct contact information for Nichimori HP If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

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Super Flexible Epoxy Adhesive Premium Flexible

Super Flexible Epoxy Adhesive Premium Flexible

Achieving rubber-like elasticity and stretch while maintaining the high reliability characteristic of epoxy resin.

NB9000 Series for IPX Level 7 Standard An epoxy resin adhesive that demonstrates rubber elasticity and achieves rubber extensibility (200%). It shows high reliability characteristic of epoxy resin, exhibits better heat resistance than rubber (silicone, urethane), and performs adequately even at extremely low temperatures. It also meets the waterproof standard of IPX Level 7. Flexibility, Elasticity, Extend like Rubber with higher performance Silicon Rubber. Premium Elasticity Epoxy Adhesive. NB9000 Series passed IPX Level 7 Standard. Direct contact information for Nichimoly HP If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

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Aerospace Adhesive - Low Outgassing Adhesive for Space Programs

Aerospace Adhesive - Low Outgassing Adhesive for Space Programs

Meets ASTM standards! Ideal low outgassing adhesive for the manufacturing and assembly of aircraft and space equipment. *Other products in the lineup are also currently undergoing evaluation applications!

The space adhesive provided by our company has been evaluated using the ASTM E 595 standard, one of the largest standardization organizations in the world, for gases emitted from space-grade organic materials, and it has been confirmed to meet the standards. It can be used in the manufacturing and assembly of aircraft and space equipment. Please refer to the catalog for specifications. 【Features】 ■ Evaluated for gases emitted from space-grade organic materials using the ASTM E 595 standard, one of the largest standardization organizations in the world. ■ Usable in the manufacturing and assembly of railway-related, aircraft, and space components and equipment. ------------------------------------------------------------ Please feel free to contact us for test results. * Applications for other product lines are also in progress! ------------------------------------------------------------ * For more details, please download the catalog or feel free to contact us.

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Interconnection Conductive Adhesive Silver Epoxy

Interconnection Conductive Adhesive Silver Epoxy

Adhesives for interconnection of various sizes and types of die attach and modules.

We provide conductive adhesives for die bonding of small to large IC chips and for module interconnection. We have prepared a lineup for improved workability and different application methods. Our NIC BOND is used for all sizes of IC bonding and module interconnection. For LED chips, for X-ray image ICs, for RF-ID, for IC card modules. Use methods: metal mask printing, dispensing, stamping. Direct contact information for Nichimori HP: If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

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