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Heat Resistance Grade

It is ideal for high temperature and heat-resistant applications.

- Suitable for various applications in high-temperature environments. For Any High Temp Operating Devices. High Tg, Low Out Gas, Reflow Resistant, Environmental Resistance Uniq Characters: High Tg, Low absorption, Low Outgas, Reflow Resistant Direct contact information for Nichimoly HP If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

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Super Flexible Epoxy Adhesive Premium Flexible

Achieving rubber-like elasticity and stretch while maintaining the high reliability characteristic of epoxy resin.

NB9000 Series for IPX Level 7 Standard An epoxy resin adhesive that demonstrates rubber elasticity and achieves rubber extensibility (200%). It shows high reliability characteristic of epoxy resin, exhibits better heat resistance than rubber (silicone, urethane), and performs adequately even at extremely low temperatures. It also meets the waterproof standard of IPX Level 7. Flexibility, Elasticity, Extend like Rubber with higher performance Silicon Rubber. Premium Elasticity Epoxy Adhesive. NB9000 Series passed IPX Level 7 Standard. Direct contact information for Nichimoly HP If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

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Interconnection Conductive Adhesive Silver Epoxy

Adhesives for interconnection of various sizes and types of die attach and modules.

We provide conductive adhesives for die bonding of small to large IC chips and for module interconnection. We have prepared a lineup for improved workability and different application methods. Our NIC BOND is used for all sizes of IC bonding and module interconnection. For LED chips, for X-ray image ICs, for RF-ID, for IC card modules. Use methods: metal mask printing, dispensing, stamping. Direct contact information for Nichimori HP: If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

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"Insulating" grade NIC BOND NB4000 Series

It is suitable for adhesion to areas requiring insulation. Non Conductive Type

NIC BOND NB4000, 6000 Series Meets the requirements for die bonding in electrical insulation applications, as well as high reliability, workability, and thermal conductivity. High Performance, Thermal Conductive, Non-conductive Epoxy Adhesives. Direct contact information for Nichimoly If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

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Adhesive for Hard Disk Drives

It demonstrates high reliability in the assembly of hard disk drives.

This is an adhesive with a long track record in hard disk drive assembly. Features: Low outgassing, low-temperature curing, oil resistance, halogen-free. NIC BOND (Product Number): NB3040 (two-component), NB3041B (one-component) Syringe, TNB-6322HF. High Quality High Performance for HDD Drive Assembly. Characteristic: Halogen Free, Low Out Gas, Low Temp Cure, Oil Resistant. For direct inquiries to Nichimoly HP, if you need to contact directly, please copy and paste this into your Google: https://www.daizo.co.jp/nichimoly/contact_form.html.

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Halogen Free Adhesive

Compliant with the halogen-free standards IEC, IPC, and JPCA of various international organizations.

We deliver NIC BOND products that comply with halogen-free standards, which began as part of our environmental initiatives in 2007, along with data guarantees. These products are applicable in a wide range of fields, including module assembly and the adhesion of electronic components. Our NIC BOND meets Halogen Free Standards of IEC, IPC, and JPCA. We provide data on halogen. For direct inquiries to Nichimori HP, please copy and paste the following link into your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

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