glue(metal) - List of Manufacturers, Suppliers, Companies and Products

glue Product List

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Interconnection Conductive Adhesive Silver Epoxy

Interconnection Conductive Adhesive Silver Epoxy

Adhesives for interconnection of various sizes and types of die attach and modules.

We provide conductive adhesives for die bonding of small to large IC chips and for module interconnection. We have prepared a lineup for improved workability and different application methods. Our NIC BOND is used for all sizes of IC bonding and module interconnection. For LED chips, for X-ray image ICs, for RF-ID, for IC card modules. Use methods: metal mask printing, dispensing, stamping. Direct contact information for Nichimori HP: If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

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Heat-resistant adhesive U-METAL AD1000

Heat-resistant adhesive U-METAL AD1000

This is an inorganic high-temperature adhesive capable of withstanding 1000°C, primarily composed of amorphous silica and inorganic silicate materials, introduced to the market as a byproduct of rocket engineering.

The heat-resistant adhesive AD1000 was introduced to the market as a byproduct of rocket engineering and is an inorganic high-temperature adhesive primarily composed of amorphous silica and inorganic silicates. It is effective for bonding high-temperature materials such as metals, stones, bricks, and ceramics. AD1000 is a one-component adhesive that cures with only the base agent, requiring no mixing. The addition of an activator accelerates the curing process. Since it is composed of inorganic, inert materials, it does not produce any gases and is resistant to concentrated sulfuric acid, concentrated hydrochloric acid, phosphoric acid, acetone, and benzene.

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Halogen Free Adhesive

Halogen Free Adhesive

Compliant with the halogen-free standards IEC, IPC, and JPCA of various international organizations.

We deliver NIC BOND products that comply with halogen-free standards, which began as part of our environmental initiatives in 2007, along with data guarantees. These products are applicable in a wide range of fields, including module assembly and the adhesion of electronic components. Our NIC BOND meets Halogen Free Standards of IEC, IPC, and JPCA. We provide data on halogen. For direct inquiries to Nichimori HP, please copy and paste the following link into your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

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