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PARQIT Light-curing resin/adhesive that fully cures with light only.

PARQIT Light-curing resin/adhesive that fully cures with light only.

Cures in a short time! "Epoxy adhesive" that hardens with light exposure, and no after-baking is required.

"Parkit" is an epoxy adhesive that can cure simply by being exposed to light or ultraviolet rays. It can cure within 30 minutes even at a depth of 10 cm, and since there is no need for heating, post-baking is also unnecessary. This reduces the labor and time required for work. It is also characterized by its wide range of applications, including adhesion, coating, insulation materials, and lens materials. [Features] - Cures only with light exposure - No curing occurs due to heat - Available in visible light / UV curing types - Can be cured with laser light or LED light (visible light type) *For more details, please download the catalog or contact us.

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PARQIT UV Hardening Temporary Adhesive

PARQIT UV Hardening Temporary Adhesive

No need for labor-intensive processes, solvents, or removal of residual adhesives! A reusable and SDGs-friendly UV-curable temporary adhesive!

The conventional representative temporary adhesives involve heating and dissolving low melting point hot melt resins, such as wax or rosin, to bond them to the substrate. After cooling, processing is carried out, and during peeling, the resin is re-melted by heating for removal. The resin remaining on the substrate is typically cleaned using washing solvents such as warm water or alkaline solutions, or by using washing solvents to dissolve and remove the temporarily bonded adhesive that has been cured by UV or heat. The new type developed by our company is a temporary adhesive that, after bonding the substrate through UV curing, incorporates a thermal history of approximately 200°C for 1 to 10 minutes, allowing for a decrease in adhesive strength at room temperature, making it peelable. Unlike thermoplastic resins, the adhesive strength decreases due to the thermal history, allowing it to withstand heat environments of around 120°C for 1 hour or 160°C for about 10 minutes. *For more details, please download the catalog or contact us.*

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PARQIT Low Shrinkage Epoxy Adhesive

PARQIT Low Shrinkage Epoxy Adhesive

A light-curing resin with low shrinkage rate that does not worry about positional displacement!

It is suitable for applications where positional misalignment of lenses, holders, fine optical components, sensors, and fibers is a concern. Liquid-curable resins shrink in volume when they change from liquid to solid during the curing reaction. This is called curing shrinkage, and in precision bonding, it can cause issues such as optical axis misalignment and positional displacement. Generally, the curing shrinkage rate of epoxy resins is about 3-5%, and even types containing inorganic fillers have a shrinkage of about 2%. This phenomenon is not limited to epoxy resins; it is also observed in acrylate resins, which typically have a higher shrinkage rate than epoxy, shrinking about 5-10%. The epoxy-based precision adhesive developed by our company contains inorganic fillers and includes types with a curing shrinkage rate of less than 1%, a linear expansion coefficient of 4-7×10^-5, and various curing wavelengths of 300 nm, 360 nm, 405 nm, as well as visible light curing types. *For more details, please download the catalog or contact us.*

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