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Adhesive for Hard Disk Drives

Adhesive for Hard Disk Drives

It demonstrates high reliability in the assembly of hard disk drives.

This is an adhesive with a long track record in hard disk drive assembly. Features: Low outgassing, low-temperature curing, oil resistance, halogen-free. NIC BOND (Product Number): NB3040 (two-component), NB3041B (one-component) Syringe, TNB-6322HF. High Quality High Performance for HDD Drive Assembly. Characteristic: Halogen Free, Low Out Gas, Low Temp Cure, Oil Resistant. For direct inquiries to Nichimoly HP, if you need to contact directly, please copy and paste this into your Google: https://www.daizo.co.jp/nichimoly/contact_form.html.

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Interconnection Conductive Adhesive Silver Epoxy

Interconnection Conductive Adhesive Silver Epoxy

Adhesives for interconnection of various sizes and types of die attach and modules.

We provide conductive adhesives for die bonding of small to large IC chips and for module interconnection. We have prepared a lineup for improved workability and different application methods. Our NIC BOND is used for all sizes of IC bonding and module interconnection. For LED chips, for X-ray image ICs, for RF-ID, for IC card modules. Use methods: metal mask printing, dispensing, stamping. Direct contact information for Nichimori HP: If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

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Warm water stripping type epoxy adhesive "NIC BOND NB10000"

Warm water stripping type epoxy adhesive "NIC BOND NB10000"

Easy to peel off in 30 minutes in warm water (60-80℃)! Reduces damage to parts, materials, and equipment.

The warm water peelable epoxy adhesive "NIC BOND NB10000" is a temporary adhesive that can be easily peeled off with warm water at temperatures between 60°C and 80°C. It is an epoxy-based adhesive that can cure at room temperature to low temperatures, and after curing, it has adhesive strength equivalent to that of standard epoxy resin adhesives. It is expected to be useful for temporary bonding applications during the processing of materials that are difficult to peel off after bonding, such as "silicone ingots, sapphire, glass, neodymium-based magnetic materials, and semiconductors." 【Features】 ■ Cures at room temperature ■ High strength epoxy adhesive ■ Peels off in warm water (60-80°C) in 30 minutes ■ Does not use lactic acid, acidic or alkaline solutions, or other chemicals *For more details, please refer to the catalog or feel free to contact us.

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Adhesives "Stretchable Epoxy" and "Peelable Epoxy" Catalog

Adhesives "Stretchable Epoxy" and "Peelable Epoxy" Catalog

Super flexible "stretchable epoxy adhesive" and "removable epoxy adhesive" with warm water.

In "User Manual for Super Flexible Epoxy Adhesive," we introduce super flexible epoxy adhesives like NIC BOND. The warm water removable epoxy adhesive "NIC BOND NB10000" is a temporary adhesive that can be easily removed with warm water at 60°C to 80°C. The catalog features the characteristics of super flexible epoxy, case studies, and a lineup of adhesives for various applications, as well as the features, basic properties, and test photos of warm water removable epoxy adhesives. [Contents] ■ Stretchable Epoxy What is super flexible epoxy adhesive? Includes a Q&A section to solve your past adhesive problems. Additionally, a diverse lineup for various applications is also included! ■ Removable Epoxy The warm water removable epoxy adhesive "NIC BOND NB10000" is a temporary adhesive that can be easily removed with warm water at 60°C to 80°C. *For more details, please refer to the PDF or feel free to contact us.

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Halogen Free Adhesive

Halogen Free Adhesive

Compliant with the halogen-free standards IEC, IPC, and JPCA of various international organizations.

We deliver NIC BOND products that comply with halogen-free standards, which began as part of our environmental initiatives in 2007, along with data guarantees. These products are applicable in a wide range of fields, including module assembly and the adhesion of electronic components. Our NIC BOND meets Halogen Free Standards of IEC, IPC, and JPCA. We provide data on halogen. For direct inquiries to Nichimori HP, please copy and paste the following link into your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

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"Waterproof and dustproof" epoxy adhesive for seals IPX Level 7

"Waterproof and dustproof" epoxy adhesive for seals IPX Level 7

This is a new type of adhesive that combines ultra-flexibility and elasticity with the reliability of epoxy resin.

This is a waterproof and dustproof adhesive made from 100% epoxy resin, demonstrating rubber-like flexibility, a 200% elongation rate, and resistance to reflow, suitable for use in extreme cold to high-temperature environments. Premium Flexibility and 200% extend epoxy for waterproof. We provide Direct contact information for Nichimori HP If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

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Super Flexible Epoxy Adhesive Premium Flexible

Super Flexible Epoxy Adhesive Premium Flexible

Achieving rubber-like elasticity and stretch while maintaining the high reliability characteristic of epoxy resin.

NB9000 Series for IPX Level 7 Standard An epoxy resin adhesive that demonstrates rubber elasticity and achieves rubber extensibility (200%). It shows high reliability characteristic of epoxy resin, exhibits better heat resistance than rubber (silicone, urethane), and performs adequately even at extremely low temperatures. It also meets the waterproof standard of IPX Level 7. Flexibility, Elasticity, Extend like Rubber with higher performance Silicon Rubber. Premium Elasticity Epoxy Adhesive. NB9000 Series passed IPX Level 7 Standard. Direct contact information for Nichimoly HP If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

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Aerospace Adhesive - Low Outgassing Adhesive for Space Programs

Aerospace Adhesive - Low Outgassing Adhesive for Space Programs

Meets ASTM standards! Ideal low outgassing adhesive for the manufacturing and assembly of aircraft and space equipment. *Other products in the lineup are also currently undergoing evaluation applications!

The space adhesive provided by our company has been evaluated using the ASTM E 595 standard, one of the largest standardization organizations in the world, for gases emitted from space-grade organic materials, and it has been confirmed to meet the standards. It can be used in the manufacturing and assembly of aircraft and space equipment. Please refer to the catalog for specifications. 【Features】 ■ Evaluated for gases emitted from space-grade organic materials using the ASTM E 595 standard, one of the largest standardization organizations in the world. ■ Usable in the manufacturing and assembly of railway-related, aircraft, and space components and equipment. ------------------------------------------------------------ Please feel free to contact us for test results. * Applications for other product lines are also in progress! ------------------------------------------------------------ * For more details, please download the catalog or feel free to contact us.

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USP Class VI compliant! Pharmacopoeia compliant adhesive

USP Class VI compliant! Pharmacopoeia compliant adhesive

Adhesive compliant with the pharmacopoeia for medical devices! A safe USP Class VI compliant product that can be widely used in medical devices such as gastroscopes and ultrasound examination equipment.

This is an adhesive that complies with the pharmacopoeia for medical devices. It meets the USP Class VI standards through third-party certification testing, including acute toxicity tests (intravenous or intraperitoneal administration tests in mice), intradermal reaction tests (administering specified extract solutions under rabbit skin), and implantation tests (implanting specified test pieces under rabbit skin). It can be useful for the assembly of medical devices such as endoscopes, ultrasound machines, and MRI machines. 【Features】 ■ Complies with the pharmacopoeia for medical devices ■ Safe and widely usable for medical devices such as endoscopes and ultrasound machines, meeting USP Class VI standards *For more details, please download the catalog or feel free to contact us.

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