A heat dissipation sheet that utilizes the high thermal conductivity of carbon fibers through a unique magnetic field orientation technology, while maintaining the flexibility and adhesion properties of polymers.
It is used by placing it between heat-generating components (such as CPU, GPU, LED, etc.) and heat-dissipating components (such as heat sinks) to efficiently conduct heat from the heat-generating components to the heat-dissipating components.
【Features】
● High thermal conductivity sheet made in Japan
● Enables cooling of high heat-generating areas such as CPUs, GPUs, and high-energy-density LEDs, while keeping the low molecular siloxane content below 70 ppm, making it suitable for use near contacts like switches.
● This type retains polymer-derived adhesiveness, providing double-sided adhesion, and is a high thermal conductivity sheet with excellent fixation and follow-up properties. Since there is some adhesive on both sides, the adhesive performance is enhanced, making it easy to handle. (The adhesive strength is strong.)
● A heat dissipation sheet that maintains a balance of flexibility and adhesion.
● Ideal for cooling high heat-generating areas such as CPUs, GPUs, and high-energy-density LEDs.
● The operating temperature range is from -40°C to 150°C, and it is a sheet that is resistant to heat cycles.