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We can accommodate from BGA packages to 12” wafers!
□ The BGA package is compact yet features a 6-zone specification. □ Achieves an oxygen concentration in the furnace of below 100 ppm. □ In-plane temperature distribution: ±2℃. □ Built-in catalytic device effective for purification within the furnace. □ Wafer transport uses a uniquely developed walking beam method.
A compact reflow oven ideal for in-house experiments and small-scale production.
The tabletop solder reflow furnace [FT/HR/RF series] is a compact and low-cost reflow furnace suitable for prototyping, development, and small-scale production. Due to its small size and low price, it can be used for various applications, including solder heating and curing, temperature testing of electronic components, and material evaluation. The batch-type reflow furnace also supports temperature profile measurement and storage. Additionally, a dedicated dust collector is also available.
