FPC(フレキシブル) - メーカー・企業と製品の一覧

FPCの製品一覧

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Bump FPC

Bump FPC

Forming bumps (micro-protrusions) with a minimum diameter of Φ20µm at the terminal section of the FPC. The bumps are used as contact points and applied in high-precision circuit inspections, etc. (Flexible substrate)

The bump FPC is a bump generation technology that our company specializes in, applied to the FPC. When combined with our contact clips and hand presses, it is ideal for testing fine-pitch insertion terminals and display lighting tests. *For more details, please refer to the PDF materials or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #Special #Bump #ShortLeadTime #MassProduction

  • others

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Multilayer FPC (multilayer substrate, multilayer flexible printed circuit board)

Multilayer FPC (multilayer substrate, multilayer flexible printed circuit board)

We will manufacture multi-layer flexible substrates (3 to 6 layers) entirely from polyimide. Please look forward to our quick delivery response! (Multi-layer boards, FPC)

Taiyo Industry supports everything from prototyping to mass production. - Achieves high density through pad-on-bead technology. - Supports 400μm pitch BGA. - Improved design flexibility with high-density multilayer structures. - Also supports impedance management. For more detailed information, please feel free to contact our representative. #Flex #FPC #FlexibleSubstrate #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance

  • others

ブックマークに追加いたしました

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ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

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chemSHERPA Creation Service FPC

chemSHERPA Creation Service FPC

Proposal for outsourcing the investigation of environmental burden substances to reduce operational burden: chemSHERPA RoHS REACH TSCA non-use certificate FPC.

At Satec, we handle everything from investigating the chemical substances contained in used parts to creating environmental impact data for products. We conduct survey requests to suppliers (distributors/manufacturers) on behalf of our customers and create chemSHERPA data. We assist developers in reducing their workload, which they manage alongside their primary tasks (circuit design and operation verification). FPC Flexible circuit boards, flex boards, FPC, flex, rigid-flex High heat resistance, membrane switches, flexible circuit boards, flex, FPC, printed circuit boards, Flexible circuit boards, flex boards, FPC, flex, Hamamatsu City, Board design, boards, printed circuit boards, pattern design, assembly, SMD assembly, board analysis, circuit design, software, hardware, Electronic circuit design, rigid-flex, heat dissipation boards, Specialty boards, stretchable boards, transparent polyimide, polyimide, MEMS, chemSHERPA

  • Other resource recycling
  • Environmental Survey
  • Non-destructive testing

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Material Evaluation Services: FPC, MPI, PTFE (Flexible Substrate)

Material Evaluation Services: FPC, MPI, PTFE (Flexible Substrate)

From high-frequency applications to the design, production, evaluation testing, and analysis reports of flexible printed circuit boards with various characteristics!

We support the evaluation of high-frequency characteristics of materials under development. Our company has the know-how to handle everything from short-term prototypes to mass production of FPCs. We can provide optimal proposals tailored to the needs of material manufacturers, flexible printed circuit board manufacturers, and various equipment manufacturers. We assist in evaluating various characteristics of newly developed materials that are being improved daily.

  • others

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

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High-frequency compatible FPC

High-frequency compatible FPC

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

"High Frequency Compatible FPC" and "High Frequency Compatible Flexible Printed Circuit Board" are products designed to support low transmission loss and impedance matching. Specifications include coplanar lines, microstrip lines, and strip lines. They can be used for various applications. [Examples of Applications] ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables *For more details, please refer to the PDF document or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance #ShortDeliveryTime #MassProduction

  • others

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

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High-frequency compatible flexible substrate (LCP specification) high temperature and humidity resistant FPC

High-frequency compatible flexible substrate (LCP specification) high temperature and humidity resistant FPC

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

The "High Frequency Compatible FPC (LCP Specification)" is a product designed to support low transmission loss and impedance matching. 〇 It has moisture absorption characteristics that are less affected by humidity and other factors. ● FPC high-frequency analysis service (optional) It can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance #ShortLeadTime #MassProduction

  • others

ブックマークに追加いたしました

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ブックマーク一覧

これ以上ブックマークできません

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Ultra-fine line high-density FPC (high-precision flexible printed circuit board)

Ultra-fine line high-density FPC (high-precision flexible printed circuit board)

Ultra-fine lines, high density, and high-definition flexible printed circuit boards have made it possible to form ultra-fine circuits through the fusion of MSAP technology and via filling techniques!

The miniaturization and high functionality of electronic devices are advancing, and along with this, there is a demand for finer circuit formation. One method for forming wiring by etching copper foil (subtractive method) and a high-resolution circuit formation method is to form wiring by plating on ultra-thin copper foil (semi-additive method). The method we are introducing this time is one of the semi-additive methods, called "MSAP (Modified Semi Additive Process)." By using the MSAP method, it has become possible to achieve ultra-fine lines and high-density pattern formation, which is difficult with the subtractive method. Additionally, by combining it with the "via filling technology," which fills through-hole holes with copper plating, it becomes possible to create wiring on the through-holes, further increasing wiring density. **Features of the MSAP Method:** - Circuit formation through plating deposition enables high-precision fine wiring. - Excellent rectangularity of wiring cross-section contributes to reduced transmission loss. - Superior for high-frequency substrates/IC mounting. By merging these two processing technologies, we have realized "ultra-fine high-density FPC." #FlexibleSubstrate #Substrate #HighResolutionSubstrate #Flex #FlexiblePrintedCircuitBoard

  • others

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High elongation FPC (Flexible Printed Circuit)

High elongation FPC (Flexible Printed Circuit)

Supports over 50% elongation! There are various applications such as wearable electronic devices and robots.

The "High Stretch FPC" uses copper circuits for fine circuits and electronic component mounting, and is designed for low-temperature soldering of electronic components. For areas that require stretching, elastic conductive materials are used, accommodating stretches of over 50%. By innovating the circuit shape of the elastic conductive materials and using our smart metal masks for thick film printing, it is possible to suppress changes in resistance values. 【Features】 ■ Compatible with low-temperature soldering of electronic components ■ Accommodates stretches of over 50% ■ Capable of suppressing changes in resistance values *For more details, please refer to the PDF document or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #ShortLeadTime #MassProduction

  • others

ブックマークに追加いたしました

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Transparent FPC (Transparent Flexible Printed Circuit Board)

Transparent FPC (Transparent Flexible Printed Circuit Board)

Transparent flexible printed circuit boards contribute to improved design with excellent transparency! The fine pattern makes the wiring less noticeable.

- Use of polyimide with excellent heat resistance and flame retardancy. ⇒ [Compatible with reflow mounting] - For display devices such as digital signage, as well as medical devices and transparent film antennas! - We also accommodate small quantities and a variety of prototypes. For more detailed information, please contact us. #Transparent #Transparent FPC #Transparent Flex

  • others

ブックマークに追加いたしました

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Production of ultra-long flexible circuit boards 20M sensor FPC [Board manufacturing achievements]

Production of ultra-long flexible circuit boards 20M sensor FPC [Board manufacturing achievements]

Pattern exposure corresponding to 20m! Achieving low-cost production through innovative manufacturing methods.

We would like to introduce our achievements in substrate manufacturing. We optimized each device to handle materials in roll form and produced ultra-long substrates with a product size of 20m. We perform exposure, development, and etching processes, using polyester materials to reduce costs. We have achieved low-cost production through proposals during the manufacturing method and product design stages, as well as innovations in the manufacturing process. 【Basic Specifications】 ■ Material: Polyester / 0.075 Cu35 / 0μ ■ Processes: Etching, simple contour processing ■ Substrate Size: 20000×59 ■ Others: Flying checker not available *For more details, please refer to the PDF document or feel free to contact us.

  • Digital Signage
  • Anemometer
  • Other PCs and OA equipment

ブックマークに追加いたしました

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これ以上ブックマークできません

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