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[Must-See for Engineers!!] MEMS-Related Photo-Etching Technical Documentation Collection

[Must-See for Engineers!!] MEMS-Related Photo-Etching Technical Documentation Collection

A collection of technical materials that consolidates useful information for research and development related to MEMS, where technological development is advancing, is available for free!

MEMS, centered around photofabrication and micromachine technology, is expected to thrive in various application fields. We are pleased to present a comprehensive collection of 'Technical Data' that includes numerous processing and application technologies. This collection is filled with information on essential technologies such as 'photo-etching,' which is a key technology in MEMS and display device substrates; 'dicing processing,' a technique for accurately cutting out circuits formed on Si wafers into chips; and 'bump formation,' which is indispensable for various mounting technologies such as CSP, BGA, and flip-chip. For more details, please contact us or refer to the catalog.

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Photo etching

Photo etching

We accept small-scale prototypes using precision photolithography technology for fine processing.

We accept small-scale prototypes using photolithography and precision phototechnology, which are essential technologies in MEMS and display devices. We form thin films on substrates such as glass substrates, silicon wafers, films, and ceramics, and create fine patterns through a consistent photolithography process. We can accommodate prototypes starting from a single piece. We also support prototypes for dicing, bump formation, and more. Additionally, patterning of dielectric films and multilayer films is possible through lift-off processing. Substrate sizes can be customized. Etching of silicon wafers and glass substrates is also available. We can respond with short lead times (consultation required), and we support both rigid and flexible printed circuit (FPC) substrates. For more details, please contact us or refer to our catalog.

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  • Etching

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