List of Electrical installation products
- classification:Electrical installation
7291~7335 item / All 10520 items
Since the construction-generated soil will be recycled on-site, the disposal costs for leftover soil and the costs for new purchases will be significantly reduced. 【Disaster Prevention】
- Special Construction Method
The Noto Reconstruction Office of the Ministry of Land, Infrastructure, Transport and Tourism has featured our 3D printer in the Nikkei newspaper.
The official X account of the Noto Reconstruction Office of the Ministry of Land, Infrastructure, Transport and Tourism and the Nihon Keizai Shimbun have published that our 3D printer has been adopted for the reconstruction of Noto. The official X account of the Noto Reconstruction Office introduces the use of our products in the restoration work of the Noto Expressway. Additionally, the Nihon Keizai Shimbun mentions that structures made with our products are being used for the restoration of roads damaged by the Noto Peninsula earthquake, and that the construction period can be shortened by about two weeks, so please take a look.
Contributing to the second stage of public infrastructure! Bringing public infrastructure development to the ground. A robust outdoor storage tank for hazardous materials capable of responding to the ...
- Water Treatment
We have prepared an S-type with a lamp that allows for visual inspection of the energized state for short circuit accident measures!
- Wiring devices
The wire size can now be increased for 15A and 20A types!
- Wiring devices
Leave all your wiring needs to us, from equipment construction to medical facilities!
- Wiring devices
Recommended grounding taps for stores, offices, factories, and research facilities.
- Wiring devices
Wiring devices composed of highly safe parts that conform to medical JIS T 1021 standards.
- Wiring devices
Mini-type branching cable suitable for events and similar occasions.
- Wiring devices
Ideal for power distribution in high-density racks that require multiple power strips!
- Wiring devices
We are developing a system that makes various inconveniences occurring on-site convenient and comfortable.
- Other analytical equipment
- Monitoring and Control Equipment
Technology that supports ease of use and beauty! We have prepared a diverse lineup.
- Projector
- Video conferencing system
- Audio and video equipment
Responsibility design and construction of industrial solar power systems at Attic without subcontracting 990.
- Power generation equipment
Responsible design and construction of industrial solar power systems at Attic without subcontracting 990
- Power generation equipment
We guarantee a warranty of 10 to 15 years from each manufacturer.
- Solar power generation equipment
- Photovoltaic power generation system (solar system, energy-saving housing, electricity sales business)
[Minimum and Lightweight Class, Easy Operation Settings] Ideal for business trips and travel, this lightweight handheld type is easy to carry. Body weight: 3.3 kg.
- Electrical Equipment Testing
New solar power generation to be installed on the carport
- Solar power generation equipment
- Photovoltaic power generation system (solar system, energy-saving housing, electricity sales business)
TIIS (Intrinsic Safety Explosion-Proof Standard) certified multi-gas detector. Compact, easy to handle, and highly reliable operation. The highest level of protection against dust and water.
- Gas leak device
- Safety and consumables
- Other analytical equipment
Announcement of the new release of the Gas Detector Solution Pack to easily and quickly enhance the safety of gas detectors.
Honeywell Japan, Inc. (Minato-ku, Tokyo, Representative Director: Yasushi Fujii) will launch a solution pack that allows for easy in-house bump testing and calibration of portable gas detectors to enhance safety. Regular in-house maintenance (bump testing and gas calibration) for portable gas detectors. Items included in the gas detector solution pack: Honeywell Japan portable gas detectors (select the required models from the following) ■ Multi-gas detectors - MicroClip X3 (flammable gases, carbon monoxide, hydrogen sulfide, oxygen, diffusion type, Japan explosion-proof compliant) - GasAlertMax XT2 (flammable gases, carbon monoxide, hydrogen sulfide, oxygen, pump suction type, Japan explosion-proof compliant) - BW Ultra, etc. (flammable gases, carbon monoxide, hydrogen sulfide, oxygen, VOCs, etc., pump suction type) ■ Single-gas detectors - BW Solo series (carbon monoxide, oxygen, carbon dioxide, ammonia, ozone, others) ■ Automatic calibrator IntelliDoX (supports bump testing and automatic calibration) ■ Calibration gases (we provide the optimal calibration gas based on the specified type of gas detector)
GPS built-in type (with time correction function) for various events - a countdown display! It uses high-brightness LEDs for easy visibility.
- others
- Information display device
Low-cost, high-performance USB high-speed camera!
- Other measuring instruments
- Audio and video equipment
Explaining the installation conditions and heat dissipation that affect the results of introducing a silent rack using examples! Also includes common mistakes in server operations and their countermea...
- Shelves and racks
- Terminal board/equipment storage rack
- Other office supplies
Contributing to the community through comprehensive electrical equipment, 'Technology of Sanden'.
- Solar power generation equipment
- Power generation equipment
By simply adding the treatment agent, it is possible to easily treat heavy metals such as fluorine, antimony, and arsenic contained in water! It can be easily installed for low concentration treatment...
- others
- Power Equipment
- Steel
Condensation prevention measures discharge water vapor to the outside air, providing strong protection for electronic devices inside the panel and box. Unlike moisture-absorbing materials, it does not...
- others
- Terminal board/equipment storage rack
Active at the solar power plant! You can trust us to take care of it!
- maintenance
- Solar power generation equipment
Recommended for those learning about thermal power generation equipment for the first time! It is widely attended by those in sales and administrative positions as well.
- Power generation equipment
- Other services and technologies
- others
No valve socket required: Directly bonding the valve and PVC pipe allows for a significant reduction in construction time!
- Piping and electrical wiring materials
We will exhibit at "VIET WATER 2024" (held in Ho Chi Minh, Vietnam).
Period: November 6-8, 2024 Location: Saigon Exhibition and Convention Center (SECC) Booth No. P03 At this exhibition, we will showcase the "Direct Valve," the first integrated bronze valve and PVC socket developed by Yamato Valve. We will also introduce various other high-quality and reasonably priced products for overseas markets, based on over 100 years of production and sales experience.
Observe the crystal structure with EBSD! Data can be obtained for each metal.
- Electrical Equipment Testing
- Other analytical equipment
Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
Visualize the features that appeared in the graph! You can check the distribution of crystal sizes and the orientation of crystal orientations.
- Electrical Equipment Testing
- Other analytical equipment
Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
The EBSD method allows for the estimation of crystal states and residual stresses! Here is an example of BGA analysis.
- Electrical Equipment Testing
- Other analytical equipment
Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
We will introduce an example of crystal analysis of intermetallic compounds at solder joints.
- Electrical Equipment Testing
- Other analytical equipment
Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
I will introduce an example of analysis using EBSD where orientation was observed in the Al wiring.
- Electrical Equipment Testing
- Other analytical equipment
Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
We will introduce an example of analysis using EBSD for screws (Cu2Zn).
- Electrical Equipment Testing
- Other analytical equipment
Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
I will introduce an example of analysis using EBSD for pipes (austenite).
- Electrical Equipment Testing
- Other analytical equipment
Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
The EBSD method allows for the estimation of crystal size distribution and residual stress.
- Electrical Equipment Testing
- Other analytical equipment
Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
Changes in crystal orientation and crystal grain size can be analyzed! We introduce the EBSD (Electron Backscatter Diffraction) method.
- Electrical Equipment Testing
- Other analytical equipment
Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
Observe the changes before and after compression on the copper plate! You can compare the half-life of the crystal grain size before and after compression.
- Electrical Equipment Testing
- Other analytical equipment
Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
We will introduce an example of analyzing EBSD patterns (Kikuchi patterns) at gold wire bond joints.
- Electrical Equipment Testing
- Other analytical equipment
Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
Cut the number of connection boxes and significantly reduce construction costs! Indoor free-standing panel from 100kW to 500kW.
- Photovoltaic power generation system (solar system, energy-saving housing, electricity sales business)
- Solar power generation equipment
Supports everything from small-capacity inverters in distributed systems to large-capacity power generation systems!
- Photovoltaic power generation system (solar system, energy-saving housing, electricity sales business)
- Solar power generation equipment