A systematic explanation of the latest trends such as chiplets and 3D packaging, the fundamentals of epoxy resin, the design and evaluation of encapsulants, and next-generation materials!
■Title: "Latest Trends in Semiconductor Packaging and Design/Evaluation Technologies for Semiconductor Encapsulation Materials" --- This seminar systematically explains encapsulation materials that respond to evolving semiconductor packages such as chiplets and 3D packages, covering everything from raw materials like epoxy resins, hardeners, and additives to design and evaluation. It will also introduce technological trends for next-generation encapsulation materials, including low dielectric, high thermal conductivity, and optoelectronic integration. 【Knowledge Gained from the Seminar】 - Types of semiconductor packages and the latest trends - Characteristics of wire bond, flip chip, wafer level, and advanced packages - Molding methods such as transfer and compression molding - Raw materials like epoxy resins, hardeners, and inorganic fillers - Required properties of encapsulation materials and material design technologies - Design for heat resistance, moisture resistance, and low stress - Evaluation techniques for moisture absorption reflow, heat cycles, and high temperature/high humidity - Next-generation encapsulation materials for low dielectric, high thermal conductivity, and optoelectronic integration 【Target Audience for the Seminar】 - Engineers involved in the design and use of semiconductor encapsulation materials - Designers of epoxy resins and hardeners for semiconductor encapsulation materials - Individuals interested in semiconductor packages and encapsulation materials
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■Event Details Date and Time: September 29, 2026 (Tuesday) 13:30 - 16:30 Participation Fee: 44,000 yen (tax included) *Includes materials and on-demand streaming *Newsletter subscribers: 39,600 yen (tax included) Participation Method: This seminar will be a live-streamed seminar using "Zoom." Instructor: Mr. Kazuhiro Nomura Representative of NB Research Specialization: Design and development of semiconductor encapsulants, adhesives, and modified epoxy resin products.
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Participation Fee: 44,000 yen (tax included) *Includes materials and on-demand streaming *For our newsletter members (registration is free) 39,600 yen (tax included) ★【Newsletter Member Benefit】If two or more people apply simultaneously and all applicants register as newsletter members, the participation fee per person will be half of the newsletter member price.
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We provide the latest industrial insights to our clients. By conducting market trend analysis, publishing technology‑related books and research reports, and organizing and managing seminars, we support research and development across a wide range of industries, with a primary focus on manufacturing. Our coverage spans diverse fields such as energy, batteries, chemicals, and biotechnology.
