The bonding structure is undergoing dramatic changes due to the high density and 3D integration of semiconductors. A systematic explanation of the latest challenges and countermeasures in resin sealing technology and packaging that correspond to fine and narrow pitch designs.
■ Title: "Changes in Joint Structures and Packaging Response Due to the Evolution of Semiconductors - Addressing the Increase in the Number of Joint Locations and Narrow Spacing with Resin Sealing Technology -" ――Organizing the core of joint design and sealing technology essential for the WLP and 3D assembly era. Covering the failure mechanisms and countermeasures associated with high integration, providing insights directly related to development, evaluation, and mass production challenges. ■ Date and Time: May 15, 2026 (Friday) 13:00 - 16:30 ■ Zoom Streaming (with materials) 【Knowledge Gained from the Seminar】 - Development history and trends of semiconductor packaging - Changes in semiconductor joint structures and the current state of packaging technology response - Evolution of semiconductor packaging and the development history, challenges, and countermeasures of resin sealing technology 【Target Audience for the Seminar】 - Stakeholders in the semiconductor-related fields (sales, technical positions, etc.) - Individuals interested in semiconductor manufacturing technology (front-end, back-end, etc.) - Those interested in the evolution of semiconductor packaging and the corresponding packaging technology - Individuals interested in semiconductor integration = joint technology (Bumping Technology)
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■Event Details Date and Time: May 15, 2026 (Friday) 13:00 - 16:30 Zoom Streaming (with materials)
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Tuition Fee - General: 44,000 yen (tax included) - Newsletter Member: 39,600 yen (tax included) ★【Newsletter Member Benefit】If two or more people apply at the same time and all applicants register as newsletter members, the participation fee per person will be half of the newsletter member price.
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Our company monitors market trends for various chemicals, functional materials, and products, and conducts various market research, publishes market information, and supports research and development. Additionally, we also watch market trends in energy, batteries, various chemicals, functional materials, pharmaceuticals, and healthcare. We support research and development through commissioned research, publication of market information, and hosting technical seminars.
