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  6. April 10 Webinar: Comprehensive Explanation of Basic Information on Semiconductor Packaging Technology

April 10 Webinar: Comprehensive Explanation of Basic Information on Semiconductor Packaging Technology

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last updated:Mar 31, 2026

CMC RESEARCH Ltd.
CMC RESEARCH Ltd.
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A systematic explanation from the basics of semiconductor packaging to the design and evaluation of encapsulation materials. A leading expert thoroughly organizes practical perspectives from WLP/PLP to high thermal conductivity materials.

■Title: Basic Information on Semiconductor Packaging Technology: Comprehensive Explanation ■Date and Time: April 10, 2026 (Friday) 10:30 AM - 4:30 PM ■Target Audience for the Seminar - Individuals involved in semiconductor packaging (sales, technology) - Those interested in semiconductor packaging technology - Those interested in semiconductor resin encapsulation and encapsulation materials ■Knowledge Gained from the Seminar - Development history of semiconductor packaging (PKG) - Development history of semiconductor packaging technology (methods, materials) - Specifications of semiconductor encapsulation materials (raw materials, composition, manufacturing equipment, evaluation methods, etc.)

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20260410 半導体パッケージング技術の基本情報:徹底解説.png

April 10 Webinar: Comprehensive Explanation of Basic Information on Semiconductor Packaging Technology

20260410 半導体パッケージング技術の基本情報:徹底解説.png
20260410 半導体パッケージング技術の基本情報:徹底解説.png
  • Related Link - https://cmcre.com/archives/140047/

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basic information

■Event Details Date and Time: April 10, 2026 (Friday) 10:30 AM - 4:30 PM Participation Fee: 55,000 yen (tax included) *Includes materials *For our newsletter subscribers (free registration): 49,500 yen (tax included) Method of Attendance: This seminar will be a live-streamed seminar using "Zoom."

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Tuition fee: 55,000 yen (tax included) *Includes materials *For our newsletter members (registration is free): 49,500 yen (tax included) ★【Newsletter Member Benefit】If two or more people apply at the same time and all applicants register as newsletter members, the participation fee per person will be half of the newsletter member price.

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Book "All About Semiconductor Packaging and Assembly Technology"

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CMC RESEARCH Ltd.

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We provide the latest industrial insights to our clients. By conducting market trend analysis, publishing technology‑related books and research reports, and organizing and managing seminars, we support research and development across a wide range of industries, with a primary focus on manufacturing. Our coverage spans diverse fields such as energy, batteries, chemicals, and biotechnology.

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