4/8 Webinar "AI Data Center Heat Dissipation/Cooling Technology"

The rapid increase in data center power due to the expansion of generative AI. Organizing from a practical perspective the transition from air cooling to liquid cooling, cold aisle, water cooling in-row, and immersion cooling.

■Title: Heat Dissipation/Cooling Technology for AI Data Centers ■Date and Time: April 8, 2026 (Wednesday) 10:30 AM - 4:30 PM ■Target Audience for the Seminar Electronic equipment designers (assembly design, mechanical design, circuit design, PCB design), heat dissipation device/material developers, quality assurance, and quality control departments ■Knowledge Gained from the Seminar - Basic knowledge of heat transfer - Knowledge of heat dissipation in component and PCB design - Common methods for thermal design of forced air cooling and natural air cooling equipment - Thermal design methods for heat sinks, etc.

Data CentresPower and Energy EquipmentIT Control and Services